Product Details
Place of Origin: CHINA
Brand Name: WDS
Certification: CE
Model Number: WDS620
Document: Product Brochure PDF
Payment & Shipping Terms
Minimum Order Quantity: 1
Price: US$3080-3280 Unit Price
Packaging Details: wooden case
Delivery Time: 3-5days
Payment Terms: TT
Supply Ability: 200
Placement Accuracy: |
±0.01mm |
Dimensions: |
L800xW780xH810mm |
Weight: |
Approx. 55kg |
Placement Mode: |
Semi Automatic |
Pcb Thickness: |
0.3-5mm |
Power Supply: |
220V/110V |
Bga Size: |
Max. 80x80mm |
Heating Method: |
Infrared + Hot Air |
Alignment Accuracy: |
±0.01mm |
Applicable Chip Size: |
Max 80*80mm Min 0.8*0.8mm |
Chip Amplification: |
1-200X |
The Power Supply: |
5300W |
Machine Weight: |
85KG |
Temperature Interfaces: |
5PCS |
Pcb Locating Way: |
Outer Or Location Hole |
Uppper Heating Power: |
Hot Air 1200W |
Bga Chip Size: |
Max120*120mm Min 0.8*0.8mm |
Total Power Supply: |
7600W |
Temperature Interface: |
1pcs |
Operation Type: |
Software And MCGS Touch Screen Control |
Suitable Pcb Size: |
Max 610*480mm Min 10*10mm |
Preheatingarea: |
Adjustable |
Operation Modes: |
Manual Mode |
Placement Accuracy: |
±0.01mm |
Dimensions: |
L800xW780xH810mm |
Weight: |
Approx. 55kg |
Placement Mode: |
Semi Automatic |
Pcb Thickness: |
0.3-5mm |
Power Supply: |
220V/110V |
Bga Size: |
Max. 80x80mm |
Heating Method: |
Infrared + Hot Air |
Alignment Accuracy: |
±0.01mm |
Applicable Chip Size: |
Max 80*80mm Min 0.8*0.8mm |
Chip Amplification: |
1-200X |
The Power Supply: |
5300W |
Machine Weight: |
85KG |
Temperature Interfaces: |
5PCS |
Pcb Locating Way: |
Outer Or Location Hole |
Uppper Heating Power: |
Hot Air 1200W |
Bga Chip Size: |
Max120*120mm Min 0.8*0.8mm |
Total Power Supply: |
7600W |
Temperature Interface: |
1pcs |
Operation Type: |
Software And MCGS Touch Screen Control |
Suitable Pcb Size: |
Max 610*480mm Min 10*10mm |
Preheatingarea: |
Adjustable |
Operation Modes: |
Manual Mode |
The Semi Automatic BGA Rework Station is a highly efficient and reliable tool designed specifically for motherboard repair and other advanced electronic maintenance tasks. With its robust build and precise control, this rework station is ideal for professionals and technicians who require accuracy, speed, and consistency in their work. Featuring a semi automatic placement mode, the device balances manual control with automated processes, allowing users to achieve high-quality results without sacrificing flexibility.
One of the standout features of this BGA rework station is its three heating zone design. This advanced heating system ensures uniform temperature distribution across the PCB during the rework process, minimizing thermal stress and preventing damage to delicate components. Each of the three heating zones can be independently controlled, providing maximum precision when heating different sections of the PCB. This capability is crucial when working with complex motherboards where different components require varying heat levels for safe and effective repair.
The station supports PCB thicknesses ranging from 0.3mm up to 5mm, accommodating a wide array of circuit boards. This versatility makes it suitable for repairing everything from thin, flexible PCBs to thicker, more robust boards commonly found in industrial applications. Additionally, the device can handle PCB sizes up to a maximum of 470x380mm, ensuring that even larger motherboards and electronic assemblies can be serviced without the need for multiple setups or adjustments.
Weighing approximately 55kg, the Semi Automatic BGA Rework Station is built with durable materials that provide stability and longevity. Despite its substantial weight, the design incorporates ergonomic features that facilitate ease of use and safe handling during operation. The balance between weight and portability allows technicians to move the unit within their workspace comfortably while maintaining the stability needed for precision tasks.
Power consumption is a critical consideration for any rework station, and this model efficiently operates at 5200W. This power rating ensures rapid heating and consistent temperature maintenance across all three heating zones, significantly reducing the time required for heating and cooling cycles. Efficient energy use also contributes to cost savings over time, making the Semi Automatic BGA Rework Station a practical investment for repair shops and manufacturing facilities alike.
In semi automatic placement mode, the machine assists technicians by automating critical steps such as component alignment and reflow heating, while still allowing manual intervention when necessary. This hybrid approach enhances productivity and reduces the risk of human error, making it particularly useful for motherboard repair where precision is paramount. The semi automatic mode ensures that delicate BGAs are positioned accurately and soldered with optimal heat profiles, resulting in durable and reliable repairs.
Overall, the Semi Automatic BGA Rework Station is a comprehensive solution for anyone involved in the repair and refurbishment of motherboards and other complex PCBs. Its combination of three heating zones, semi automatic operation, and support for a broad range of PCB sizes and thicknesses makes it an indispensable tool in modern electronics repair. Whether you are a professional technician or a small repair business, this rework station offers the performance, flexibility, and durability needed to tackle even the most challenging motherboard repair tasks efficiently.
| PCB Size | Max. 470x380mm |
| BGA Size | Max. 80x80mm |
| Placement Mode | Semi Automatic |
| PCB Thickness | 0.3-5mm |
| Placement Accuracy | ±0.01mm |
| Power Consumption | 5200W |
| Heating Method | Infrared + Hot Air (three heating zone with Infrared preheating table) |
| Dimensions | L800xW780xH810mm |
| Weight | Approx. 55kg |
| Power Supply | 220V/110V |
The WDS Semi Automatic BGA Rework Station, model WDS620, is a highly reliable and efficient tool designed for precision motherboard repair and rework tasks. Manufactured in China and certified with CE, this advanced rework station combines infrared preheating table technology with a sophisticated optical alignment system to ensure accurate and safe handling of delicate electronic components. Its semi-automatic placement mode allows for user-friendly operation while maintaining high placement accuracy of ±0.01mm, making it ideal for both professional repair technicians and electronics manufacturers.
This rework station is suitable for a wide range of application occasions, including the repair and rework of motherboards in laptops, desktops, and other electronic devices that utilize BGA components. The infrared preheating table gently and evenly heats the PCB with thickness ranging from 0.3mm to 5mm, minimizing thermal stress and preventing damage during the rework process. The combined heating method of infrared plus hot air ensures efficient solder melting and component placement, significantly improving the success rate of repairs.
In scenarios such as electronics repair shops, manufacturing quality control, R&D laboratories, and small to medium-sized production lines, the WDS620 excels by providing precise optical alignment of BGA chips. This optical alignment system allows technicians to visually align components accurately before placement, reducing errors and increasing overall efficiency. Its power supply options of 220V or 110V make it adaptable to various working environments worldwide.
Packaged securely in a wooden case to ensure safe delivery, the WDS620 is available with a minimum order quantity of just one unit, and the delivery time is typically between 3-5 days. With a supply ability of 200 units, it is well-suited to meet both individual and bulk purchasing needs. Payment terms via TT provide convenience and flexibility for buyers. The WDS Semi Automatic BGA Rework Station is an indispensable tool for anyone involved in electronic component repair, offering precision, reliability, and ease of use in diverse application occasions and professional scenarios.
Brand Name: WDS
Model Number: WDS620
Place of Origin: CHINA
Certification: CE
Minimum Order Quantity: 1 unit
Packaging Details: The Semi Automatic BGA Rework Station is securely packed in a wooden case to ensure safe delivery.
Delivery Time: 3-5 days
Payment Terms: TT
Supply Ability: 200 units per month
Placement Mode: Semi Automatic
PCB Size Compatibility: Supports PCBs up to a maximum size of 470x380mm.
Heating Method: Utilizes a combination of infrared preheating table and hot air for efficient and even heating.
BGA Size Compatibility: Can handle BGA components up to 80x80mm in size.
Dimensions: The equipment measures L800xW780xH810mm, making it suitable for various workspace setups.
The WDS620 Semi Automatic BGA Rework Station features an advanced optical alignment system, ensuring precise positioning during cpu repair and other sensitive operations.
The Semi Automatic BGA Rework Station is designed to provide precise and efficient soldering and desoldering of Ball Grid Array (BGA) components. It features a user-friendly interface with programmable temperature profiles to ensure optimal heating and cooling cycles, minimizing the risk of thermal damage to sensitive electronic components.
Our technical support team is dedicated to assisting you with installation, operation, and maintenance of the BGA Rework Station. We provide comprehensive guidance on setting up the equipment, selecting appropriate nozzles, and calibrating temperature sensors for accurate performance.
In addition to troubleshooting hardware and software issues, we offer training materials and tutorials to help users maximize the capabilities of the station. Regular firmware updates and recommended maintenance schedules are also provided to ensure long-term reliability and efficiency.
For advanced repair and calibration services, the Semi Automatic BGA Rework Station can be sent to authorized service centers equipped with specialized diagnostic tools and genuine replacement parts. Our service technicians are trained to handle complex repairs and ensure the device meets all operational specifications.
We strive to support our customers throughout the lifecycle of the product, ensuring high-quality rework results and minimizing downtime in your manufacturing or repair processes.
Product Packaging and Shipping
The Semi Automatic BGA Rework Station is carefully packaged to ensure safe transportation and delivery. Each unit is securely placed in a custom-fitted foam mold inside a sturdy, durable carton box to prevent any damage during shipping.
Packaging includes all necessary accessories, user manuals, and cables, neatly organized and protected within the box. The outer packaging is clearly labeled with product details, handling instructions, and shipping information for easy identification.
We offer multiple shipping options to accommodate your needs, including standard air freight, express courier services, and sea freight for bulk orders. All shipments are tracked and insured to guarantee timely and secure delivery.
Upon receiving your Semi Automatic BGA Rework Station, please inspect the package for any visible damage and report any issues immediately to our customer service team for prompt assistance.
Q1: What is the brand and model of this Semi Automatic BGA Rework Station?
A1: The brand is WDS and the model number is WDS620.
Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?
A2: It is manufactured in China.
Q3: Does the WDS620 BGA Rework Station have any certifications?
A3: Yes, it is CE certified.
Q4: What is the minimum order quantity for the WDS620?
A4: The minimum order quantity is 1 unit.
Q5: How is the WDS620 Semi Automatic BGA Rework Station packaged for delivery?
A5: It is packaged securely in a wooden case.
Q6: What is the typical delivery time for this product?
A6: The delivery time is typically between 3 to 5 days.
Q7: What payment terms are accepted for purchasing the WDS620?
A7: Payment is accepted via TT (Telegraphic Transfer).
Q8: What is the supply ability of the WDS semi automatic BGA rework station?
A8: The supply ability is 200 units.