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Home > products > Manual BGA Rework Station > WDS 520 Laser BGA Reballing Machine For Mobile Phone Laptop Motherboard

WDS 520 Laser BGA Reballing Machine For Mobile Phone Laptop Motherboard

Product Details

Place of Origin: China

Brand Name: WDS

Certification: CE

Model Number: WDS-520

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 UNIT

Packaging Details: Wooden case

Delivery Time: 8-15 working days

Payment Terms: T/T, Western Union, MoneyGram

Supply Ability: 150 UNITS PER MONTH

Get Best Price
Highlight:

WDS 520 Laser BGA Reballing Machine

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Laptop Motherboard Laser BGA Reballing Machine

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WDS 520 Laser Reballing Machine

Application:
Rework BGA
Keyword:
Welding Robot China
Advantage:
Low Weight
Application:
Rework BGA
Keyword:
Welding Robot China
Advantage:
Low Weight
WDS 520 Laser BGA Reballing Machine For Mobile Phone Laptop Motherboard

IR Preheater lead-free Infrared WDS-520 BGA Rework Station

 

Product Description

 

  • Our BGA Rework Station/BGA reballing station are widely used to replace and repair the BGA chip in laptop , mobile phone , xbox 360, ps3,etc.
  • The main user is repairing shops and factory to provide the after-sales service and rework.

 

        Manual BGA Rework Station

        Model:WDS-520

  1.  Repair Success Rate:More Than 99%
  2. Using The Industriak Touche Screen
  3. Independent 3 Heating Zones, Hot Air Heating/ Infrared Preheat.(temperature accuracy ± 2°C)
  4. With CE Certification

        Main Features

        Operation System

  • Manual mode.
  • Can solder, desolder, mount, pick and replace chip.
  • User-friendly.

       Strict Temperature Control System

 

  • 8 segments rising temperature/constant time/ temperature rising slope, it can save hundreds of groups temperature curve.
  • It adopts high accuracy K-type thermocouple close-loop control.
  • The external sensor can detect temperature precisely, analyze and calibrate the real temperature curve accurately at any time.

       Safety Sustem

  • With CE cetification
  • With automatic power-off protection device when abnormal accident happens and double over-temp protection fuction.             
Power supply   AC 220V ± 10% 50Hz
Total power   3800W
Heater power    Upper temp.zone 800W, second temp.zone 1200W, IR temp.zone 1800W(1200W controlled)
Electrical material

 Touch screen+Temperature control module+ microcontrollers

Locating way  V-shape card slot + Universal jigs
PCB size  Max 300mm*280mm Min 10mm*10mm
Applicable chips  Max 60mm*60mm Min 1mm*1mm
PCB thickness  0 .3-5mm
Overall dimension  L460mm*W480mm*H500mm
Weight of machine  About 30KG
Usage  Repair chips/phone motherboard etc.