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Home > products > Semi Automatic BGA Rework Station > WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair

WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair

Product Details

Place of Origin: China

Brand Name: WDS

Certification: CE

Model Number: WDS-850

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 UNIT

Packaging Details: Wooden case

Delivery Time: 8-15 working days

Payment Terms: T/T, Western Union, MoneyGram

Supply Ability: 150 UNITS PER MONTH

Get Best Price
Highlight:

WDS-850 BGA Repair Machine

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phone motherboard BGA Repair Machine

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WDS-850 BGA Repair machine

Warranty:
1 Year
Weight:
200KG
Voltage:
AC 220V
Current:
50/60hz
Dimensions:
L970*W7000*H830mm
Total Power:
8400W
PCB Size:
Max680*550mm Min 10*10 Mm
BGA Chip Size:
Max120*120mm Min 0.8*0.8mm
Power:
Ac220v ±10%,50/60hz
Heater Power:
Upper Temp.one 1600w,second Temp.zone1600w,IR Temp.zone 5000w
Alignment System:
Optical Prism + HD Camera
Warranty:
1 Year
Weight:
200KG
Voltage:
AC 220V
Current:
50/60hz
Dimensions:
L970*W7000*H830mm
Total Power:
8400W
PCB Size:
Max680*550mm Min 10*10 Mm
BGA Chip Size:
Max120*120mm Min 0.8*0.8mm
Power:
Ac220v ±10%,50/60hz
Heater Power:
Upper Temp.one 1600w,second Temp.zone1600w,IR Temp.zone 5000w
Alignment System:
Optical Prism + HD Camera
WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair

HD display Vacuum adsorption WDS-850 Optical alignment automatic repair equipment

 

Excellent performance features

  1. Multi-language menu interface
  2. Automatic feeding decive
  3. X/Y axis can be controlled by rocker, fast oeration
  4. Imported high-definition CCD(2 million pixels) optical alignment ststem
  5. High precision temperature control system, accurate temperature control system, accuate temperature control

WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair 0

 

HD display Vacuum adsorption WDS-850 Optical alignment automatic repair equipment

 

Excellent performance features

  1. Multi-language menu interface
  2. Automatic feeding decive
  3. X/Y axis can be controlled by rocker, fast oeration
  4. Imported high-definition CCD(2 million pixels) optical alignment ststem
  5. High precision temperature control system, accurate temperature control system, accuate temperature control

WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair 1

HD optical alignment and intelligent control

 

The integrated design of hot air head and mounting head has the functions of automatic mounting, automatic welding and automatic disassembly. High precision K-type thermocouple (KSENSOR) cLOSED Loop control, up and down independent temperature measurement, temperature control accuracy up to ± 1 degree, Over-temperature protection alarm function, software encryption and anti-stay function.

 

WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair 2

HD display

 

High-definition imported CCD(2 million pixels) digital imaging, automatic optical zoom system, automatic precision alignment control system with laser red dot, using 15 inch high-definition industrial display screen dispaly.

 

WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair 3

 

Vacuum adsorption and preheating platform

 

The upper heating head is equipped with a vacuum suction pipe for chip adsorption. The bottom preheating platform adopts imported excellent heating materials(infrared gold-plated light tube)+anti-flash thermostatic glass (temperature resistance up to 1800°C). The preheating area is up to 500*420mm. The preheating platform, splint device and cooling system can be moved as a whole in the X direction. Make PCB positioning and folding welding more safe and convenient.

 

WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair 4

 

HD optical alignment and intelligent control

 

The integrated design of hot air head and mounting head has the functions of automatic mounting, automatic welding and automatic disassembly. High precision K-type thermocouple (KSENSOR) cLOSED Loop control, up and down independent temperature measurement, temperature control accuracy up to ± 1 degree, Over-temperature protection alarm function, software encryption and anti-stay function.

 

WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair 5

 

HD display

 

High-definition imported CCD(2 million pixels) digital imaging, automatic optical zoom system, automatic precision alignment control system with laser red dot, using 15 inch high-definition industrial display screen dispaly.

 

Vacuum adsorption and preheating platform

 

The upper heating head is equipped with a vacuum suction pipe for chip adsorption. The bottom preheating platform adopts imported excellent heating materials(infrared gold-plated light tube)+anti-flash thermostatic glass (temperature resistance up to 1800°C). The preheating area is up to 500*420mm. The preheating platform, splint device and cooling system can be moved as a whole in the X direction. Make PCB positioning and folding welding more safe and convenient.

 

Specification

 

Model WDS-850
Total power supply 8400W
Upper heating power supply 1600W
Lower heating power supply 1600W
IR heating power supply 5000W(2000W controlled)
Power supply 220V, 50/60Hz
Maximum 680*550mm
Minimum 10*10mm
Temperature measuring interfaces 5pcs
Chip zoom in and zoom out 2-50/times
The PCB thickness 0.5~8mm
Apply chip size 0.8*0.8~120*120mm
Applicable minimum chip spacing 0.15mm
Maximum mouting load 300g
Mounting precision ±0.01mm
Machine dimension L970*W700*H830mm
Machine weight 200KG