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WDS-850 BGA Repair Machine
, phone motherboard BGA Repair Machine
, WDS-850 BGA Repair machine
Warranty: |
1 Year |
Weight: |
200KG |
Voltage: |
AC 220V |
Current: |
50/60hz |
Dimensions: |
L970*W7000*H830mm |
Total Power: |
8400W |
PCB Size: |
Max680*550mm Min 10*10 Mm |
BGA Chip Size: |
Max120*120mm Min 0.8*0.8mm |
Power: |
Ac220v ±10%,50/60hz |
Heater Power: |
Upper Temp.one 1600w,second Temp.zone1600w,IR Temp.zone 5000w |
Alignment System: |
Optical Prism + HD Camera |
WDS-850 BGA Repair machine Optical Alignment Automatic Rework station for PC&phone motherboard chip repair
HD display Vacuum adsorption WDS-850 Optical alignment automatic repair equipment
Excellent performance features
- Multi-language menu interface
- Automatic feeding decive
- X/Y axis can be controlled by rocker, fast oeration
- Imported high-definition CCD(2 million pixels) optical alignment ststem
- High precision temperature control system, accurate temperature control system, accuate temperature control
HD display Vacuum adsorption WDS-850 Optical alignment automatic repair equipment
Excellent performance features
- Multi-language menu interface
- Automatic feeding decive
- X/Y axis can be controlled by rocker, fast oeration
- Imported high-definition CCD(2 million pixels) optical alignment ststem
- High precision temperature control system, accurate temperature control system, accuate temperature control
HD optical alignment and intelligent control
The integrated design of hot air head and mounting head has the functions of automatic mounting, automatic welding and automatic disassembly. High precision K-type thermocouple (KSENSOR) cLOSED Loop control, up and down independent temperature measurement, temperature control accuracy up to ± 1 degree, Over-temperature protection alarm function, software encryption and anti-stay function.
HD display
High-definition imported CCD(2 million pixels) digital imaging, automatic optical zoom system, automatic precision alignment control system with laser red dot, using 15 inch high-definition industrial display screen dispaly.
Vacuum adsorption and preheating platform
The upper heating head is equipped with a vacuum suction pipe for chip adsorption. The bottom preheating platform adopts imported excellent heating materials(infrared gold-plated light tube)+anti-flash thermostatic glass (temperature resistance up to 1800°C). The preheating area is up to 500*420mm. The preheating platform, splint device and cooling system can be moved as a whole in the X direction. Make PCB positioning and folding welding more safe and convenient.
HD optical alignment and intelligent control
The integrated design of hot air head and mounting head has the functions of automatic mounting, automatic welding and automatic disassembly. High precision K-type thermocouple (KSENSOR) cLOSED Loop control, up and down independent temperature measurement, temperature control accuracy up to ± 1 degree, Over-temperature protection alarm function, software encryption and anti-stay function.
HD display
High-definition imported CCD(2 million pixels) digital imaging, automatic optical zoom system, automatic precision alignment control system with laser red dot, using 15 inch high-definition industrial display screen dispaly.
Vacuum adsorption and preheating platform
The upper heating head is equipped with a vacuum suction pipe for chip adsorption. The bottom preheating platform adopts imported excellent heating materials(infrared gold-plated light tube)+anti-flash thermostatic glass (temperature resistance up to 1800°C). The preheating area is up to 500*420mm. The preheating platform, splint device and cooling system can be moved as a whole in the X direction. Make PCB positioning and folding welding more safe and convenient.
Specification
| Model |
WDS-850 |
| Total power supply |
8400W |
| Upper heating power supply |
1600W |
| Lower heating power supply |
1600W |
| IR heating power supply |
5000W(2000W controlled) |
| Power supply |
220V, 50/60Hz |
| Maximum |
680*550mm |
| Minimum |
10*10mm |
| Temperature measuring interfaces |
5pcs |
| Chip zoom in and zoom out |
2-50/times |
| The PCB thickness |
0.5～8mm |
| Apply chip size |
0.8*0.8～120*120mm |
| Applicable minimum chip spacing |
0.15mm |
| Maximum mouting load |
300g |
| Mounting precision |
±0.01mm |
| Machine dimension |
L970*W700*H830mm |
| Machine weight |
200KG |
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