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Full Auto CCD BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Big Motherboard Repair

Product Details

Place of Origin: Guangdong, China

Brand Name: WDS

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: CN¥339,653.24

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Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                                                                                                            Full Auto CCD BGA Rework Station, 1200x900mm Repair Size BGA Repair Machine, ±0.01mm Mounting Precision BGA Soldering Station
                      

Max Input Power:	100 W	Rated Capacity:	10400W
Voltage:	110/220V	Dimensions:	L1350W1300H1920mm
Weight:	650kg	Repair Size:	Max1200900mm, Min 1010 Mm
BGA Size:	Max120120mm, Min 0.60.6mm	Mounting Precision:	±0.01mm
Thermocouple Port:	13pcs	Heater Power:	Upper Heater 1200W, Bottom Heater 1200W, IR Heater 8000W MAX
Temperature Precision:	± 1℃	PCB Size:	Max 1200 ×700mm Min 10×10 Mm
Applicable PCB Thickness:	0.3-8mm	Chip Amplification:	1-200X
Min Chip Space:	0.15mm

Max Input Power:	100 W
Rated Capacity:	10400W
Voltage:	110/220V
Dimensions:	L1350W1300H1920mm
Weight:	650kg
Repair Size:	Max1200900mm, Min 1010 Mm
BGA Size:	Max120120mm, Min 0.60.6mm
Mounting Precision:	±0.01mm
Thermocouple Port:	13pcs
Heater Power:	Upper Heater 1200W, Bottom Heater 1200W, IR Heater 8000W MAX
Temperature Precision:	± 1℃
PCB Size:	Max 1200 ×700mm Min 10×10 Mm
Applicable PCB Thickness:	0.3-8mm
Chip Amplification:	1-200X
Min Chip Space:	0.15mm

Full Auto CCD BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Big Motherboard Repair

WDS-1250 Auto CCD BGA Rework Station

Full automatic BGA rework station with CCD camera system for large motherboard repair, featuring PLC control and 110V/220V operation

Application Domain

Designed for large-size industrial control motherboards and 5G service motherboard repair with maximum PCB size of 1200mm × 700mm. Computer-controlled operations with HD optical alignment system and 3-in-1 heating (hot air + IR + gas). Suitable for removing/soldering various chip types including POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, and MLF.

Technical Specifications

Power Supply	AC 110V/220V ±10% 50/60Hz
Total Power	Max 10400W
Heater Power	Upper heater 1200W, bottom heater 1200W, IR heater 8000W MAX
Locating System	Optical camera + V-shape card slot + adjustable PCB support jigs + laser positioning
Temperature Control	High precision K-sensor (Closed Loop), ±1℃ accuracy
Control System	Servo motor + PLC control + smart temperature controller + touch screen IPC
PCB Size Range	Max 1200×700mm, Min 10×10mm (customizable)
PCB Thickness	0.3-8mm
Chip Size Range	Max 120×120mm, Min 0.6×0.6mm
Minimum Chip Space	0.15mm
Mounting Accuracy	±0.01mm
Alignment System	Optical lens + HD industrial camera
Temperature Sensors	13 points
Dimensions	1350×1300×1920mm (L×W×H)
Weight	650kg