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Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair

Product Details

Place of Origin: Guangdong, China

Brand Name: Wisdomshow

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: CN¥339,653.24

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Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                                                                                                            Full Auto BGA Rework Station, 1200x900mm Repair Size BGA Repair Machine, ±0.01mm Mounting Precision BGA Soldering Station
                      

Max Input Power:	28000W	Voltage:	110/220V
Dimensions:	L1350W1300H1850mm	Weight:	1000kg
Repair Size:	Max1200900mm, Min 1010mm	BGA Size:	Max120120mm, Min 0.60.6mm
Mounting Precision:	±0.01mm	Thermocouple Port:	13pcs
Total Power:	Max 10400W	Heater Power:	Upper Heater 1200W, Bottom Heater 1200W, IR Heater 8000W MAX
Temperature Precision:	±1℃	PCB Size:	Max 1200×700mm, Min 10×10mm
Applicable PCB Thickness:	0.3-8mm	Chip Amplification:	1-200X
Min Chip Space:	0.15mm

Max Input Power:	28000W
Voltage:	110/220V
Dimensions:	L1350W1300H1850mm
Weight:	1000kg
Repair Size:	Max1200900mm, Min 1010mm
BGA Size:	Max120120mm, Min 0.60.6mm
Mounting Precision:	±0.01mm
Thermocouple Port:	13pcs
Total Power:	Max 10400W
Heater Power:	Upper Heater 1200W, Bottom Heater 1200W, IR Heater 8000W MAX
Temperature Precision:	±1℃
PCB Size:	Max 1200×700mm, Min 10×10mm
Applicable PCB Thickness:	0.3-8mm
Chip Amplification:	1-200X
Min Chip Space:	0.15mm

Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair

WDS-1250 Auto CCD BGA Rework Station

Full automatic BGA rework station designed for large industrial control motherboards and 5G service motherboard repair with maximum PCB size support of 1200mm × 700mm.

Application Domain

Specifically designed for large-size industrial control motherboards and 5G service motherboard repair. Features computer-controlled operations with HD optical alignment system and 3-in-1 heating technology (hot air + IR + gas including nitrogen or compressed air). Suitable for removing or soldering various chip types including POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, and MLF.

Technical Specifications

Power Supply	AC 110V/220V ±10% 50/60Hz
Total Power	Max 10400W
Heater Power	Upper heater 1200W, bottom heater 1200W, IR heater 8000W MAX
Locating System	Optical camera + V-shape card slot + adjustable PCB support jigs + laser positioning
Temperature Control	High precision K-sensor (Closed Loop), ±1℃ precision
Electrical Components	Servo motor + PLC control + smart temperature controller + high sensitivity touch screen IPC
PCB Size	Max 1200 × 700mm, Min 10 × 10mm (customizable)
PCB Thickness	0.3-8mm
Chip Size Range	Max 120 × 120mm, Min 0.6 × 0.6mm
Minimum Chip Space	0.15mm
Mounting Accuracy	±0.01mm
Alignment System	Optical lens + HD industrial camera
Temperature Interfaces	13 sensors
Overall Dimensions	L1350 × W1300 × H1920mm
Weight	650KG

Key Features

10-axis interlock system with electric motor drive control for all movements
Stores over 5000 temperature profiles for high-volume motherboard rework
Upper heater and CCD camera can move front/back and left/right to eliminate dead angles
Manual flow cool down system protects chips from high temperature damage
Side camera for monitoring solder ball melting during process
High sensitivity touch screen IPC with intelligent operation system
Built-in vacuum pump with automatic memory function
Automatic nozzle height identification with precise pressure control (10 grams range)
22x optical zoom with color high-definition optical system
Heat and mount head 2-in-1 design with auto rotation and removal functions
Dual-channel heating system with 80mm air outlet for fast temperature response
Large bottom preheater zone (720×600mm) with German infrared heating panels
Nitrogen inlet for protected soldering process