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Home > Products > Semi Automatic BGA Rework Station > Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair

Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair

Product Details

Place of Origin: Guangdong, China

Brand Name: Wisdomshow

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: CN¥339,653.24

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Highlight:

Full Auto BGA Rework Station

,

1200x900mm Repair Size BGA Repair Machine

,

±0.01mm Mounting Precision BGA Soldering Station

Max Input Power:
28000W
Voltage:
110/220V
Dimensions:
L1350*W1300*H1850mm
Weight:
1000kg
Repair Size:
Max1200*900mm, Min 10*10mm
BGA Size:
Max120*120mm, Min 0.6*0.6mm
Mounting Precision:
±0.01mm
Thermocouple Port:
13pcs
Total Power:
Max 10400W
Heater Power:
Upper Heater 1200W, Bottom Heater 1200W, IR Heater 8000W MAX
Temperature Precision:
±1℃
PCB Size:
Max 1200×700mm, Min 10×10mm
Applicable PCB Thickness:
0.3-8mm
Chip Amplification:
1-200X
Min Chip Space:
0.15mm
Max Input Power:
28000W
Voltage:
110/220V
Dimensions:
L1350*W1300*H1850mm
Weight:
1000kg
Repair Size:
Max1200*900mm, Min 10*10mm
BGA Size:
Max120*120mm, Min 0.6*0.6mm
Mounting Precision:
±0.01mm
Thermocouple Port:
13pcs
Total Power:
Max 10400W
Heater Power:
Upper Heater 1200W, Bottom Heater 1200W, IR Heater 8000W MAX
Temperature Precision:
±1℃
PCB Size:
Max 1200×700mm, Min 10×10mm
Applicable PCB Thickness:
0.3-8mm
Chip Amplification:
1-200X
Min Chip Space:
0.15mm
Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair
WDS-1250 Auto CCD BGA Rework Station
Full automatic BGA rework station designed for large industrial control motherboards and 5G service motherboard repair with maximum PCB size support of 1200mm × 700mm.
Application Domain
Specifically designed for large-size industrial control motherboards and 5G service motherboard repair. Features computer-controlled operations with HD optical alignment system and 3-in-1 heating technology (hot air + IR + gas including nitrogen or compressed air). Suitable for removing or soldering various chip types including POP, CCGA, BGA, QFN, CSP, LGA, Micro SMD, and MLF.
Technical Specifications
Power Supply AC 110V/220V ±10% 50/60Hz
Total Power Max 10400W
Heater Power Upper heater 1200W, bottom heater 1200W, IR heater 8000W MAX
Locating System Optical camera + V-shape card slot + adjustable PCB support jigs + laser positioning
Temperature Control High precision K-sensor (Closed Loop), ±1℃ precision
Electrical Components Servo motor + PLC control + smart temperature controller + high sensitivity touch screen IPC
PCB Size Max 1200 × 700mm, Min 10 × 10mm (customizable)
PCB Thickness 0.3-8mm
Chip Size Range Max 120 × 120mm, Min 0.6 × 0.6mm
Minimum Chip Space 0.15mm
Mounting Accuracy ±0.01mm
Alignment System Optical lens + HD industrial camera
Temperature Interfaces 13 sensors
Overall Dimensions L1350 × W1300 × H1920mm
Weight 650KG
Key Features
  • 10-axis interlock system with electric motor drive control for all movements
  • Stores over 5000 temperature profiles for high-volume motherboard rework
  • Upper heater and CCD camera can move front/back and left/right to eliminate dead angles
  • Manual flow cool down system protects chips from high temperature damage
  • Side camera for monitoring solder ball melting during process
  • High sensitivity touch screen IPC with intelligent operation system
  • Built-in vacuum pump with automatic memory function
  • Automatic nozzle height identification with precise pressure control (10 grams range)
  • 22x optical zoom with color high-definition optical system
  • Heat and mount head 2-in-1 design with auto rotation and removal functions
  • Dual-channel heating system with 80mm air outlet for fast temperature response
  • Large bottom preheater zone (720×600mm) with German infrared heating panels
  • Nitrogen inlet for protected soldering process
Product Images
Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 0 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 1 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 2 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 3 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 4 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 5 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 6
Packaging
Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 7 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 8
Why Choose WDS
  • Manufacturer with own factory, design team, and production facilities
  • Rich experience in BGA rework station technology
  • Product development based on customer feedback
  • OEM services available
  • 100% new products directly from WDS factory
  • Excellent quality control and inspection teams
  • Good reputation domestically and internationally
  • Free spare parts within 1 year warranty
  • Lifetime technical support and training
Business Partners
Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 9 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 10 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 11 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 12 Full Auto BGA Rework Station with 1200x900mm Repair Size and ±0.01mm Mounting Precision for Motherboard Repair 13