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Home > Products > Semi Automatic BGA Rework Station > High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair

High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair

Product Details

Place of Origin: Guangdong, China

Brand Name: Wisdomshow(WDS)

Certification: CE ISO

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: CN¥1,522.49

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Highlight:

High-definition External Camera BGA Rework Station

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Precise Chip Positioning BGA Repair Machine

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Independent Three-Zone Temperature Control BGA Chip Replacement Machine

Max Input Power:
800W
Rated Capacity:
800W
Voltage:
110V/220V
Dimensions:
L30*W20*H10mm
Weight:
2kg
Welding Mode:
Hot Air Heating & IR Heating
PCB Size:
Max 380*280mm, Min 10*10mm
BGA Chip Size:
Max 60*60mm, Min 1*1mm
Power Supply:
AC 110V/220V±10% 50HZ
Temperature Accuracy:
± 1°C
Temperature Profiles:
8-segment
Alignment Accuracy:
± 0.01 Mm
Display Size:
15-inch HD
Material:
Metal
Electrical Material:
High Sensitive Temperature Control Module, Touch Screen (Taiwan)
Max Input Power:
800W
Rated Capacity:
800W
Voltage:
110V/220V
Dimensions:
L30*W20*H10mm
Weight:
2kg
Welding Mode:
Hot Air Heating & IR Heating
PCB Size:
Max 380*280mm, Min 10*10mm
BGA Chip Size:
Max 60*60mm, Min 1*1mm
Power Supply:
AC 110V/220V±10% 50HZ
Temperature Accuracy:
± 1°C
Temperature Profiles:
8-segment
Alignment Accuracy:
± 0.01 Mm
Display Size:
15-inch HD
Material:
Metal
Electrical Material:
High Sensitive Temperature Control Module, Touch Screen (Taiwan)
High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair
High-Definition External Camera for BGA Rework Station
Clear imaging and precise chip positioning for efficient BGA repair operations.
Equipment Overview
The WDS-620 is a semi-automatic, high-precision BGA rework station designed for professional rework of complex SMT components. It features an independent three-zone temperature control system, high-definition optical alignment, and an intelligent operating interface.
This extended version includes an additional external side camera, allowing operators to clearly observe the solder melting process during reflow, ensuring higher accuracy and improved quality control.
High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair 0 High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair 1
Key Features
Independent Three-Zone Temperature Control System
  • Upper and lower heating zones use hot-air circulation; IR preheating zone uses infrared heating
  • Temperature accuracy ±1°C, supporting 8-segment temperature profiles
  • Large IR bottom heater ensures uniform PCB heating and prevents board warpage
  • Each heating unit can be controlled independently
  • Supports localized hot-air heating on BGA and PCB simultaneously while preheating the entire bottom area
  • K-type thermocouple closed-loop, PID auto-tuning, multi-curve display, curve analysis, external thermal sensor input for real-time curve calibration
  • All temperature parameters adjustable directly on the touchscreen
High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair 2
Precise Optical Alignment System
  • High-definition CCD color vision with beam splitting, zoom, autofocus
  • Automatic color difference compensation and brightness adjustment
  • 15-inch HD display for clear alignment view
  • Alignment accuracy: ±0.01 mm
High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair 3
We also accept custom orders and can assist with applying your own brand labels.
Main Specifications
High-definition External Camera BGA Rework Station with Precise Chip Positioning and Independent Three-Zone Temperature Control for Efficient Repair 4
Packaging & Shipping
  • Package: Individual standard export box
  • Delivery: Within 3 work days after receiving full payment
  • Shipping method: Sea freight
  • Loading port: Shenzhen