Product Details
Place of Origin: CHINA
Brand Name: WDS
Certification: CE
Model Number: WDS620
Document: Product Brochure PDF
Payment & Shipping Terms
Minimum Order Quantity: 1
Price: US$3080-3280 Unit Price
Packaging Details: wooden case
Delivery Time: 3-5days
Payment Terms: TT
Supply Ability: 200
Placement Mode: |
Semi Automatic |
Heating Method: |
Infrared + Hot Air |
Placement Accuracy: |
±0.01mm |
Pcb Thickness: |
0.3-5mm |
Power Supply: |
AC 110V/220V±10% 50HZ |
Pcb Size: |
Max. 470x380mm |
Bga Size: |
Max. 80x80mm |
Weight: |
Approx. 55kg |
Bga Chips: |
Max80*80mm, Min1*1mm |
Functionality: |
Automated |
Power Consumption: |
5200W |
Total Power: |
2500W |
Temperature Precision: |
±1℃ |
Temp Seasuring Interface: |
1pcs |
Max Mouting Load: |
150g |
Heating Time: |
120 Seconds |
Down Heater Power: |
Max 1200W |
Heating Type: |
Infrared And Hot Air |
Machine Mode: |
Auto/semi-auto/manual |
Working Modes: |
5 |
Min Chip Space: |
0.15mm |
Placement Mode: |
Semi Automatic |
Heating Method: |
Infrared + Hot Air |
Placement Accuracy: |
±0.01mm |
Pcb Thickness: |
0.3-5mm |
Power Supply: |
AC 110V/220V±10% 50HZ |
Pcb Size: |
Max. 470x380mm |
Bga Size: |
Max. 80x80mm |
Weight: |
Approx. 55kg |
Bga Chips: |
Max80*80mm, Min1*1mm |
Functionality: |
Automated |
Power Consumption: |
5200W |
Total Power: |
2500W |
Temperature Precision: |
±1℃ |
Temp Seasuring Interface: |
1pcs |
Max Mouting Load: |
150g |
Heating Time: |
120 Seconds |
Down Heater Power: |
Max 1200W |
Heating Type: |
Infrared And Hot Air |
Machine Mode: |
Auto/semi-auto/manual |
Working Modes: |
5 |
Min Chip Space: |
0.15mm |
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The Semi Automatic BGA Rework Station is a state-of-the-art solution designed for precision and efficiency in the repair and rework of Ball Grid Array (BGA) components. Engineered to meet the demands of modern electronic manufacturing and repair environments, this rework station combines advanced technology with user-friendly features to ensure optimal performance and reliability.
One of the standout features of this rework station is its advanced optical alignment system. This system provides exceptional accuracy during the placement and alignment of BGA components, allowing operators to achieve a placement accuracy of ±0.01mm. Such precision is critical when working with high-density circuit boards and fine-pitch components, where even the slightest misalignment can lead to device failure or reduced functionality. The optical alignment system ensures that components are positioned perfectly before the reflow process begins, significantly reducing the risk of errors and rework.
The rework station is equipped with a three heating zone design, which plays a crucial role in the soldering and desoldering process. These three independent heating zones allow for precise temperature control across different areas of the printed circuit board (PCB). By maintaining consistent and controlled heat distribution, the system minimizes thermal stress on sensitive components and the PCB itself. This feature enhances the quality of solder joints and extends the lifespan of electronic devices undergoing repair.
Integral to the heating process is the Infrared preheating table, which provides uniform and efficient preheating to the PCB before the main reflow heating begins. Preheating the board is essential to prevent thermal shock and warping, especially when dealing with large PCBs or complex assemblies. The Infrared preheating table ensures that heat is evenly distributed across the board, preparing it for the precise reflow of BGA components and improving overall repair success rates.
The Semi Automatic BGA Rework Station supports PCBs up to a maximum size of 470x380mm, accommodating a wide range of board sizes commonly used in various electronic applications. This versatility makes it suitable for repairing everything from small consumer electronics to larger industrial circuit boards. Despite its robust capabilities, the machine maintains a compact footprint with dimensions of L800xW780xH810mm, making it suitable for use in laboratories, workshops, and production lines without occupying excessive space.
Powering this sophisticated equipment is a reliable power supply compatible with both 220V and 110V inputs, ensuring flexibility and ease of integration into different electrical environments worldwide. The power consumption of the rework station is 5200W, reflecting its high-performance heating elements and advanced control systems designed for rapid and efficient rework processes. This balance of power and efficiency allows users to achieve quick turnaround times without compromising on quality or safety.
In summary, the Semi Automatic BGA Rework Station is an indispensable tool for professionals in electronics manufacturing and repair. Its combination of an optical alignment system, three heating zones, and an Infrared preheating table provides unmatched precision and thermal control for BGA component rework. With support for large PCB sizes, a flexible power supply, and a compact design, this rework station delivers exceptional value and performance, making it a top choice for ensuring high-quality electronic repairs and manufacturing processes.
| Heating Method | Infrared + Hot Air |
| Weight | Approx. 55kg |
| Power Supply | 220V/110V |
| Dimensions | L800 x W780 x H810mm |
| Placement Accuracy | ±0.01mm |
| Placement Mode | Semi Automatic |
| Power Consumption | 5200W |
| PCB Size | Max. 470 x 380mm |
| BGA Size | Max. 80 x 80mm |
| PCB Thickness | 0.3 - 5mm |
The WDS620 Semi Automatic BGA Rework Station, manufactured by WDS in China, is an advanced and reliable solution for professionals engaged in electronic component repair and assembly. Certified with CE standards, this BGA rework station is designed to provide precision and efficiency in handling complex PCB rework tasks. With a maximum PCB size capacity of 470x380mm and a placement accuracy of ±0.01mm, it ensures meticulous alignment and soldering of BGA components.
This BGA rework station is equipped with a unique heating method that combines infrared and hot air heating, allowing for uniform and controlled temperature distribution. The inclusion of three heating zones facilitates precise temperature management across the board, reducing the risk of thermal damage and improving the quality of rework. This feature is especially important for delicate electronic components that require consistent and accurate heat application.
The semi-automatic placement mode of the WDS620 enables technicians to efficiently position and solder BGAs with ease, enhancing productivity without compromising precision. Weighing approximately 55kg and packaged securely in a wooden case, it is robust and suitable for various workshop environments. The product's supply ability of 200 units, along with a minimum order quantity of just one, makes it accessible for both small-scale repair shops and larger production facilities.
Typical application occasions for the WDS620 BGA rework station include repairing malfunctioning motherboards, smartphones, gaming consoles, and other electronic devices that incorporate BGA chips. It is highly useful in electronics manufacturing plants, repair centers, and R&D laboratories where precise rework of surface-mounted devices is critical. The quick delivery time of 3-5 days and payment terms via TT further streamline the procurement process for businesses.
In summary, the WDS620 Semi Automatic BGA Rework Station stands out as an essential tool for accurately and efficiently reworking BGA components. Its three heating zone system utilizing hot air heating combined with infrared technology ensures high-quality soldering results, making it a preferred choice for electronic repair and manufacturing professionals worldwide.
Introducing the WDS620 Semi Automatic BGA Rework Station by WDS, a reliable solution originating from China and certified with CE standards. This advanced BGA rework station features an Infrared preheating table and a three heating zone system, ensuring precise and efficient soldering for BGA components up to a maximum size of 80x80mm.
With a powerful heating method combining Infrared and Hot Air, and a power consumption of 5200W, the WDS620 delivers consistent performance for various rework tasks. Its robust design measures L800xW780xH810mm and weighs approximately 55kg, making it durable yet manageable in typical workshop environments.
Each unit is carefully packaged in a wooden case to guarantee safe delivery. The minimum order quantity is 1, with a supply ability of 200 units and a delivery time of only 3-5 days. Payment terms are TT, providing flexible transaction options.
The WDS620 BGA rework station is ideal for professionals seeking high-quality, efficient, and precise rework solutions with three heating zones and an integrated Infrared preheating table to enhance soldering accuracy and reduce thermal stress.
The Semi Automatic BGA Rework Station is designed to provide precise and efficient soldering and desoldering of Ball Grid Array (BGA) components. This advanced equipment combines accuracy, reliability, and ease of use, making it ideal for repairing and reworking electronic circuit boards.
Our technical support team is dedicated to assisting you with installation, operation, and troubleshooting to ensure optimal performance of your BGA Rework Station. Comprehensive user manuals and instructional materials are provided to guide you through the setup and maintenance processes.
We offer professional training sessions to help users become proficient in using the station effectively, covering topics from basic operation to advanced repair techniques. Regular software updates and calibration services are available to maintain the precision and functionality of the equipment.
In addition, we provide warranty coverage and prompt repair services to minimize downtime. Our support includes remote diagnostics and expert consultation to resolve any technical issues quickly.
For ongoing support and to maximize the lifespan of your Semi Automatic BGA Rework Station, we recommend following the maintenance schedules and operating guidelines outlined in the product documentation.
Product Packaging:
The Semi Automatic BGA Rework Station is securely packaged in a sturdy, industrial-grade cardboard box designed to protect the equipment during transit. Inside, the device is cushioned with high-density foam inserts to prevent any movement or damage. All accessories, including nozzles, solder paste, and user manuals, are neatly organized within the package. The packaging is labeled clearly with handling instructions and product details to ensure safe and efficient delivery.
Shipping:
The Semi Automatic BGA Rework Station is shipped via reliable courier services with tracking options available. Depending on the destination, shipping options include standard, expedited, and express delivery. The product is insured against damage or loss during transit. Prior to shipping, each unit undergoes a thorough quality check to guarantee it meets all operational specifications. Customers receive a confirmation email with tracking information once the product has been dispatched.
Q1: What is the brand and model number of the Semi Automatic BGA Rework Station?
A1: The brand is WDS and the model number is WDS620.
Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?
A2: It is manufactured in China.
Q3: Does the WDS620 have any certification?
A3: Yes, the WDS620 is CE certified.
Q4: What is the minimum order quantity for the WDS620 Semi Automatic BGA Rework Station?
A4: The minimum order quantity is 1 unit.
Q5: How is the WDS620 Semi Automatic BGA Rework Station packaged for shipping?
A5: It is packaged in a wooden case to ensure safe delivery.
Q6: What is the typical delivery time for the WDS620 after placing an order?
A6: The delivery time is usually between 3 to 5 days.
Q7: What payment terms are accepted for purchasing the WDS620?
A7: Payment is accepted via TT (Telegraphic Transfer).
Q8: What is the supply ability of the WDS620 Semi Automatic BGA Rework Station?
A8: The supply ability is 200 units.