WDS-620 Semi Automatic BGA Rework Station with Infrared + Hot Air Heating for Max PCB Size 470x380mm and ±0.01mm Placement Accuracy

Product Description:

The Semi Automatic BGA Rework Station is a highly efficient and reliable solution designed for professionals engaged in motherboard repair and other advanced electronics servicing. This rework station is engineered to handle Ball Grid Array (BGA) components up to a maximum size of 80x80mm, making it suitable for a wide range of applications, from small-scale repairs to more complex motherboard refurbishment tasks. Its robust design and precise control mechanisms ensure that delicate components are handled with the utmost care, significantly reducing the risk of damage during the rework process.

One of the standout features of this Semi Automatic BGA Rework Station is its integrated infrared preheating table. The infrared preheating table plays a crucial role in evenly warming the printed circuit board (PCB) before the rework process begins. Preheating helps to minimize thermal shock, which can otherwise lead to warping or damage of the motherboard during component removal or installation. This feature ensures that heat is distributed uniformly, enhancing the quality of solder joints and improving overall repair reliability. The infrared preheating table is especially beneficial when working with complex motherboards that require precise temperature control to maintain their integrity.

The station supports PCB thicknesses ranging from 0.3mm to 5mm, accommodating a variety of board types and thicknesses commonly encountered in motherboard repair. This versatility means technicians can confidently use the station for different devices without worrying about compatibility issues. The ability to adjust to varying PCB thicknesses allows for more accurate heating profiles and better soldering results, which is essential for high-quality motherboard repair operations.

Despite its powerful capabilities, the Semi Automatic BGA Rework Station maintains a manageable footprint with dimensions of L800 x W780 x H810mm. This size balances workspace efficiency with ergonomic design, ensuring that technicians have ample room to maneuver components while maintaining a compact setup that fits well within most repair labs or workstations. Weighing approximately 55kg, the station is sturdy enough to provide stability during operation but also portable enough to be repositioned as needed within a repair environment.

Power consumption is a critical consideration in any rework station, and this model delivers impressive performance with a consumption rate of 5200W. This high power capacity supports rapid heating and precise temperature control, which are vital for effective motherboard repair. The station’s power efficiency also contributes to consistent performance, allowing technicians to complete repairs more quickly and with greater confidence in the quality of the results.

Overall, the Semi Automatic BGA Rework Station is an indispensable tool for electronics repair professionals focusing on motherboard repair. Its combination of a powerful infrared preheating table, support for a wide range of PCB thicknesses, and the ability to handle large BGA components makes it a versatile and reliable choice. Whether you are performing routine repairs or tackling complex rework projects, this station offers the precision, power, and durability needed to achieve excellent outcomes every time.

In summary, this Semi Automatic BGA Rework Station offers:

• Support for BGA sizes up to 80x80mm
• Infrared preheating table for uniform and controlled heating
• Compatibility with PCB thicknesses from 0.3mm to 5mm
• Compact dimensions (L800 x W780 x H810mm) suitable for most work environments
• A weight of approximately 55kg, ensuring stability during use
• High power consumption of 5200W for rapid and precise temperature control

These features collectively make the Semi Automatic BGA Rework Station a top-tier choice for anyone involved in motherboard repair, providing the technology and support needed to maintain and restore electronic devices with confidence and efficiency.

Features:

• Product Name: Semi Automatic BGA Rework Station
• Placement Accuracy: ±0.01mm for precise motherboard repair
• Weight: Approx. 55kg for stable operation
• Heating Method: Combined Infrared + Hot Air for efficient soldering
• Includes Infrared preheating table to ensure even heating
• Placement Mode: Semi Automatic for improved productivity
• Supports PCB Thickness: 0.3-5mm, suitable for various motherboards
• Equipped with Infrared preheating table for enhanced temperature control

Technical Parameters:

Applications:

The WDS620 Semi Automatic BGA Rework Station by WDS, originating from China, is specially designed for precision and efficiency in electronic component repair and assembly. Certified with CE, this advanced rework station features a unique three heating zone system combining Infrared preheating table technology with hot air heating methods, ensuring uniform and controlled temperature distribution. This makes it ideal for handling delicate BGA components up to a maximum size of 80x80mm on PCBs with thickness ranging from 0.3 to 5mm.

Its semi automatic operation enhances user control and accuracy, making the WDS620 perfect for a variety of professional applications including electronics manufacturing, repair workshops, and research and development laboratories. The infrared preheating table effectively reduces thermal stress on PCBs during the rework process, improving solder joint quality and minimizing damage risks to sensitive components.

The WDS620 is highly suitable for occasions where precision BGA rework is essential, such as repairing motherboards, graphic cards, and other densely populated circuit boards in consumer electronics, telecommunications devices, and automotive electronics. Its compact dimensions (L800xW780xH810mm) allow it to fit conveniently into most workspaces, while its dual voltage power supply (220V/110V) ensures compatibility with different electrical standards worldwide.

This rework station is packaged securely in a wooden case to guarantee safe delivery within 3-5 days after ordering, with a minimum order quantity of one unit and a supply capacity of up to 200 units. Payment terms are flexible with TT accepted, facilitating smooth transactions. Whether used in small-scale repair shops or large manufacturing facilities, the WDS620 Semi Automatic BGA Rework Station offers a reliable, efficient solution for reflow soldering, desoldering, and precise component placement, making it an indispensable tool in modern electronics maintenance and production environments.

Customization:

The WDS Semi Automatic BGA Rework Station, model WDS620, is a high-precision tool designed for efficient motherboard repair and cpu repair tasks. Manufactured in CHINA and certified with CE, this advanced station features a semi automatic placement mode ensuring a placement accuracy of ±0.01mm, suitable for PCB sizes up to 470x380mm.

Equipped with an optical alignment system, the WDS620 provides precise component positioning to enhance repair quality and reduce errors. With a power consumption of 5200W and a weight of approximately 55kg, this station balances power and portability.

Each unit is carefully packaged in a sturdy wooden case to ensure safe delivery. The minimum order quantity is 1, with a supply ability of 200 units and a delivery time of 3-5 days. Payment terms are TT, making the procurement process straightforward and efficient for your production needs.

Support and Services:

Our Semi Automatic BGA Rework Station is designed to provide precise and efficient soldering and desoldering of Ball Grid Array (BGA) components. To ensure optimal performance and longevity of the equipment, please follow these guidelines for technical support and services.

Before using the station, carefully read the user manual to understand the operation procedures and safety precautions. Proper training is recommended for operators to handle the device effectively.

If you encounter any issues with the equipment, first refer to the troubleshooting section of the manual. Common problems such as temperature inconsistencies, nozzle alignment, or software errors can often be resolved through the suggested steps.

For maintenance, regularly clean the heating elements and nozzles to prevent contamination and ensure accurate heat distribution. Inspect all cables and connections periodically to avoid electrical faults.

Software updates and calibration services are available to keep the rework station running at peak accuracy. It is advised to perform calibration checks periodically or after prolonged use.

In case of hardware malfunction or if the problem persists after troubleshooting, seek professional repair services from authorized technicians. Using unauthorized repair services or spare parts may void the warranty and affect the device’s performance.

Keep a record of all maintenance and service activities to help diagnose future issues and maintain warranty coverage.

For optimal results, always use recommended accessories and consumables specifically designed for the Semi Automatic BGA Rework Station.

Packing and Shipping:

Product Packaging:

The Semi Automatic BGA Rework Station is carefully packaged to ensure safe delivery. It is securely placed in a custom-fitted foam insert within a sturdy, double-walled cardboard box to protect against shocks and vibrations during transit. The packaging includes all necessary accessories, user manuals, and warranty information neatly organized. Additionally, the exterior of the box is labeled with handling instructions and product details for easy identification.

Shipping:

We offer reliable shipping options to ensure your Semi Automatic BGA Rework Station arrives promptly and in perfect condition. The product is shipped via trusted courier services with tracking available for every order. Depending on your location, shipping may include standard or expedited delivery. All shipments are insured to protect against loss or damage. Customers will receive a confirmation email with tracking details once the product has been dispatched.

FAQ:

Q1: What is the brand and model number of this Semi Automatic BGA Rework Station?

A1: The brand is WDS and the model number is WDS620.

Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?

A2: It is manufactured in China.

Q3: Does the WDS620 have any certifications?

A3: Yes, the WDS620 Semi Automatic BGA Rework Station is CE certified.

Q4: What is the minimum order quantity for this product?

A4: The minimum order quantity is 1 unit.

Q5: How is the product packaged and what is the typical delivery time?

A5: The product is packaged in a wooden case and the delivery time is typically 3-5 days.

Q6: What are the payment terms available for purchasing the WDS620?

A6: The payment terms accepted are TT (Telegraphic Transfer).

Q7: What is the supply ability of the WDS620 Semi Automatic BGA Rework Station?

A7: The supply ability is 200 units.