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Home > Products > Semi Automatic BGA Rework Station > WDS-620 Automatic BGA Rework Station ASIC Hash Board PS4 Phone Repair Machine Computer Board and Car Board Repair tool

WDS-620 Automatic BGA Rework Station ASIC Hash Board PS4 Phone Repair Machine Computer Board and Car Board Repair tool

Product Details

Place of Origin: CHINA

Brand Name: WDS

Certification: CE

Model Number: WDS620

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Packaging Details: wooden case

Delivery Time: 3-5days

Payment Terms: TT

Supply Ability: 200

Get Best Price
Highlight:
Power Supply:
220V/110V
Placement Mode:
Semi Automatic
Sensor:
2PCS
Maximum Mounting Load:
300g
Placement Accuracy:
±0.01mm
Down Hot Air Heater:
Max 1200W
Power Consumption:
5200W
Pcb Size:
Max. 470x380mm
Power Supply:
220V/110V
Placement Mode:
Semi Automatic
Sensor:
2PCS
Maximum Mounting Load:
300g
Placement Accuracy:
±0.01mm
Down Hot Air Heater:
Max 1200W
Power Consumption:
5200W
Pcb Size:
Max. 470x380mm
WDS-620 Automatic BGA Rework Station ASIC Hash Board PS4 Phone Repair Machine Computer Board and Car Board Repair tool

Product Description:

WDS-620 Automatic BGA Rework Station ASIC Hash Board PS4 Phone Repair Machine Computer Board and Car Board Repair tool 0

The Semi Automatic BGA Rework Station is an advanced and reliable solution designed for precise and efficient soldering and desoldering of Ball Grid Array (BGA) components. Engineered to meet the demands of modern electronics repair and manufacturing, this rework station offers exceptional performance, making it an indispensable tool for professionals working on CPU repair, PCB refurbishment, and various surface-mount device applications.

One of the standout features of this Semi Automatic BGA Rework Station is its remarkable placement accuracy of ±0.01mm. This high degree of precision ensures that BGA components are positioned perfectly on the PCB, minimizing errors and improving solder joint quality. Accurate placement is critical, especially for complex and sensitive components such as CPUs and other microelectronic devices, where even a slight misalignment can lead to malfunction or damage.

With overall dimensions of L800xW780xH810mm, this rework station is compact enough to fit comfortably on most workbenches while providing ample workspace for handling PCBs and components. Its ergonomic design facilitates ease of operation and accessibility during repair and assembly processes.

The station supports PCB thicknesses ranging from 0.3mm to 5mm, accommodating a wide variety of circuit board types and applications. This versatility allows technicians to work on everything from thin, flexible boards to thicker, more robust PCBs without compromising performance or safety.

Power consumption is an important consideration in any rework station, and this model delivers a robust 5200W power output. The high power capacity ensures fast and consistent heating, reducing the time needed for preheating and reflow processes. This efficiency is particularly beneficial in professional environments where throughput and turnaround times are critical.

A key technological advantage of this Semi Automatic BGA Rework Station is its three heating zone design. The three heating zones provide precise temperature control and uniform heat distribution across the PCB and the component. This multi-zone heating system helps prevent thermal stress and damage to sensitive components by allowing gradual and controlled heating and cooling phases. It also enhances the reliability of solder joints by ensuring that the entire area reaches the optimal reflow temperature.

The hot air heating mechanism is central to the station's operation. Utilizing a powerful and adjustable hot air system, the rework station delivers targeted heat to the BGA component and the surrounding solder joints. This method facilitates efficient melting of solder without direct contact, reducing the risk of mechanical damage to the components or PCB. The hot air heating technique is ideal for delicate CPU repair tasks, where careful temperature management is crucial to avoid overheating and potential chip failure.

Designed to accommodate BGA components up to a maximum size of 80x80mm, this rework station covers a broad spectrum of industry-standard parts. Whether working on small integrated circuits or larger processor modules, the station provides the flexibility and control needed to handle diverse repair and assembly tasks.

Overall, the Semi Automatic BGA Rework Station combines precision engineering, advanced heating technology, and user-friendly design to deliver superior performance in electronics repair and manufacturing. Its precise placement accuracy, robust power capacity, adaptable PCB thickness range, and innovative three heating zone system make it an essential tool for professionals engaged in CPU repair and other intricate rework operations. By leveraging hot air heating technology, this station ensures safe, efficient, and reliable component reflow, ultimately enhancing product quality and reducing rework times.

 

Features:

  • Product Name: Semi Automatic BGA Rework Station
  • Down hot air heater power: Max 1200W for efficient hot air heating
  • Supports BGA size up to 80x80mm
  • Power consumption: 5200W
  • Placement mode: Semi Automatic for ease of operation
  • Equipped with 2PCS sensors for precise control
  • Features an advanced optical alignment system for accurate component placement
  • Includes an Infrared preheating table to ensure even heating and reduce thermal stress
 

Technical Parameters:

PCB Size Max. 470x380mm
Power Supply 220V/110V
Placement Accuracy ±0.01mm
Power Consumption 5200W
Dimensions L800xW780xH810mm
Upper Hot Air Heater Max 1200W
Maximum Mounting Load 300g
Sensor 2PCS
Heating Method Infrared + Hot Air
PCB Thickness 0.3-5mm
 

Applications:

The WDS620 Semi Automatic BGA Rework Station, manufactured by WDS in China, is a highly efficient and reliable tool designed specifically for precise motherboard repair and rework. Certified with CE, this advanced rework station combines infrared and hot air heating methods, ensuring uniform heating and preventing thermal damage to sensitive electronic components. With a maximum BGA size of 80x80mm and support for PCB thickness ranging from 0.3 to 5mm, it is suitable for a wide variety of electronic repair tasks, especially for densely populated circuit boards.

One of the standout features of the WDS620 is its infrared preheating table, which significantly improves the heating process by providing smooth and consistent preheating. This not only reduces thermal stress on the boards but also enhances the efficiency of the soldering and desoldering processes. The semi automatic placement mode of the rework station allows technicians to have greater control and precision during the repair process, making it ideal for both small repair shops and larger production environments.

Thanks to its powerful 5200W power consumption, the WDS620 quickly reaches the desired temperatures, reducing downtime and increasing productivity. Its packaging in a sturdy wooden case ensures safe transportation and storage, and with a minimum order quantity of just one unit, it is accessible for individual technicians or businesses. The delivery time of 3-5 days and payment terms via TT make the purchase process smooth and efficient.

With a supply ability of 200 units, the WDS620 BGA Rework Station is well-suited for various application occasions, including motherboard repair, smartphone maintenance, and other electronic device refurbishing tasks. Its semi automatic operation mode offers a balance between manual precision and automated consistency, making it indispensable for electronics manufacturing, repair centers, and quality control laboratories. Whether you are tackling complex motherboard repairs or performing routine maintenance, this rework station provides the reliability and performance necessary for professional results.

 

Customization:

The WDS Semi Automatic BGA Rework Station, model WDS620, is a high-quality product manufactured in CHINA, certified with CE to ensure reliability and safety. Designed with an infrared preheating table, this BGA rework station allows precise and efficient soldering and desoldering processes.

This semi automatic BGA rework station supports PCB thickness ranging from 0.3 to 5mm and can accommodate PCB sizes up to a maximum of 470x380mm, making it highly versatile for various applications. Equipped with 2PCS sensors, it guarantees accurate temperature control and optimal performance.

Operating at a power consumption of 5200W and weighing 55kg, the WDS620 model balances power and portability. It is supplied in a sturdy wooden case to ensure safe packaging during shipping.

With a minimum order quantity of 1 unit and a supply ability of 200 units, WDS offers prompt delivery within 3-5 days. Payment terms are TT, providing convenient and secure transactions for customers.

 

Support and Services:

The Semi Automatic BGA Rework Station is designed to provide precise and efficient soldering and desoldering of Ball Grid Array (BGA) components. It features advanced temperature control, an easy-to-use interface, and a semi-automatic alignment system to ensure accurate placement and removal of BGA chips.

Our technical support team offers comprehensive assistance for installation, operation, and maintenance of the BGA Rework Station. We provide detailed user manuals, troubleshooting guides, and firmware updates to optimize the performance of your equipment.

Services include routine calibration, repair, and replacement of parts to maintain the highest standards of accuracy and reliability. We also offer training sessions and technical consultations to help users maximize the capabilities of the rework station.

For best results, always use compatible accessories and follow recommended operating procedures. Regular maintenance and proper handling will extend the lifespan of the product and ensure consistent rework quality.

 

Packing and Shipping:

Product Packaging and Shipping

The Semi Automatic BGA Rework Station is carefully packaged to ensure safe delivery and optimal protection during transit. Each unit is securely placed in a custom-designed foam insert within a sturdy, double-walled cardboard box to prevent any damage from shocks or vibrations. All accessories, including nozzles, power cables, and user manuals, are neatly organized and packed along with the main unit.

For international shipments, the product is further wrapped in anti-static materials to protect sensitive electronic components from static discharge. The outer packaging is clearly labeled with handling instructions and shipping details to facilitate smooth logistics.

We offer multiple shipping options including air freight, express courier, and sea freight, allowing customers to choose the most suitable method based on urgency and cost considerations. Tracking information will be provided promptly after dispatch to ensure full transparency and peace of mind.

Upon receiving the Semi Automatic BGA Rework Station, customers are advised to inspect the package for any visible damage and report any issues immediately to our customer service team for swift resolution.

 

FAQ:

Q1: What is the brand and model number of this Semi Automatic BGA Rework Station?

A1: The brand name is WDS and the model number is WDS620.

Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?

A2: This product is made in China.

Q3: Does the WDS620 BGA Rework Station have any certifications?

A3: Yes, it is CE certified.

Q4: What is the minimum order quantity for the WDS620 BGA Rework Station?

A4: The minimum order quantity is 1 unit.

Q5: How is the WDS620 BGA Rework Station packaged for shipment?

A5: It is packaged in a sturdy wooden case to ensure safe delivery.

Q6: What is the typical delivery time for this product?

A6: The delivery time is usually between 3 to 5 days.

Q7: What payment terms are accepted for purchasing the WDS620?

A7: Payment is accepted via TT (Telegraphic Transfer).

Q8: What is the supply ability of the WDS620 Semi Automatic BGA Rework Station?

A8: The supply ability is 200 units.