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Home > Products > Semi Automatic BGA Rework Station > WDS-620 Semi Automatic BGA Rework Station Remove & Repair Machine for Motherboard BGA IC Chip Components

WDS-620 Semi Automatic BGA Rework Station Remove & Repair Machine for Motherboard BGA IC Chip Components

Product Details

Place of Origin: CHINA

Brand Name: WDS

Certification: CE

Model Number: WDS620

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Packaging Details: wooden case

Delivery Time: 3-5days

Payment Terms: TT

Supply Ability: 200

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Highlight:
Bga Size:
Max. 80x80mm
Power Consumption:
5200W
Power Supply:
220V/110V
Pcb Thickness:
0.3-5mm
Weight:
55kg
Pcb Size:
Max. 470x380mm
Placement Accuracy:
±0.01mm
Placement Mode:
Semi Automatic
Bga Size:
Max. 80x80mm
Power Consumption:
5200W
Power Supply:
220V/110V
Pcb Thickness:
0.3-5mm
Weight:
55kg
Pcb Size:
Max. 470x380mm
Placement Accuracy:
±0.01mm
Placement Mode:
Semi Automatic
WDS-620 Semi Automatic BGA Rework Station Remove & Repair Machine for Motherboard BGA IC Chip Components

Product Description:

WDS-620 Semi Automatic BGA Rework Station Remove & Repair Machine for Motherboard BGA IC Chip Components 0

The Semi Automatic BGA Rework Station is an advanced and reliable solution designed specifically for precise and efficient cpu repair and other complex electronic component rework tasks. This state-of-the-art BGA rework station combines innovative technology with user-friendly features to deliver exceptional performance in surface mount technology (SMT) applications, particularly for Ball Grid Array (BGA) components.

One of the standout features of this BGA rework station is its exceptional placement accuracy of ±0.01mm. This high level of precision ensures that components are positioned perfectly, reducing the risk of misalignment and enhancing the overall quality and reliability of the repair or assembly process. Whether you are working on fine-pitch BGAs or other sensitive components, this accuracy is crucial for achieving optimal results in cpu repair and other electronic device maintenance.

The station boasts a compact yet robust design with dimensions of L800xW780xH810mm, making it suitable for various workspace environments without occupying excessive space. Its thoughtfully engineered size allows technicians to work comfortably and efficiently, while still accommodating a range of PCB sizes up to a maximum of 470x380mm. This compatibility ensures versatility, enabling users to handle a wide variety of circuit boards in their repair or production workflows.

Heating is a critical aspect of any BGA rework process, and this station excels by incorporating a dual heating method: Infrared preheating table combined with hot air reflow. The Infrared preheating table gently and uniformly heats the PCB from below, minimizing thermal stress and preventing damage to sensitive components and the board itself. This method prepares the board for the subsequent hot air reflow, which provides precise and controlled heating from above to melt solder joints effectively and facilitate component removal or placement.

The semi-automatic placement mode offers a balanced approach between manual control and automated precision. This mode allows operators to guide the component placement process, ensuring careful alignment while benefiting from the station’s automated positioning capabilities. The semi-automatic system is ideal for technicians who require both flexibility and accuracy, making it an excellent choice for cpu repair tasks where attention to detail is paramount.

Overall, this Semi Automatic BGA Rework Station is an indispensable tool for professionals involved in cpu repair, electronics manufacturing, and rework services. Its combination of high placement accuracy, versatile heating methods including an Infrared preheating table, and compatibility with various PCB sizes makes it a highly effective and efficient solution for BGA rework operations.

Whether you are repairing defective components, upgrading hardware, or performing prototype assembly, the Semi Automatic BGA Rework Station provides the reliability, precision, and ease of use needed to achieve outstanding results. Investing in this BGA rework station means equipping your workshop with cutting-edge technology that enhances productivity, minimizes errors, and ensures the longevity and performance of your electronic devices.

 

Features:

  • Product Name: Semi Automatic BGA Rework Station
  • Equipped with 2PCS high-precision sensors for accurate operation
  • Compact design with a weight of 55kg for stable performance
  • Supports PCB size up to a maximum of 470x380mm
  • Maximum mounting load capacity of 300g
  • Placement mode: Semi automatic for efficient and precise component placement
  • Features an advanced optical alignment system to ensure perfect positioning
  • Ideal for semi automatic BGA rework tasks with enhanced reliability
 

Technical Parameters:

Power Supply 220V/110V
Down Hot Air Heater Max 1200W
Heating Method Infrared preheating table + Hot Air Heating
Placement Mode Semi Automatic with Optical Alignment System
Dimensions L800 x W780 x H810 mm
BGA Size Max. 80 x 80 mm
PCB Thickness 0.3 - 5 mm
PCB Size Max. 470 x 380 mm
Weight 55 kg
Maximum Mounting Load 300 g
 

Applications:

The WDS Semi Automatic BGA Rework Station, model WDS620, originating from China and certified with CE, is a highly efficient and reliable tool designed for precision electronic repair tasks. With a robust build weighing 55kg and dimensions of L800xW780xH810mm, this station is engineered to provide stable and accurate rework performance in various demanding environments.

Equipped with an advanced optical alignment system, the WDS620 ensures highly precise positioning of components, which is crucial for successful BGA (Ball Grid Array) rework processes. This feature significantly reduces the risk of misalignment, thus enhancing the quality and reliability of repairs. The station’s dual hot air heaters, each capable of reaching a maximum power of 1200W, allow for efficient and uniform heating from both upper and lower sides, making it ideal for complex motherboard repair tasks and CPU repair where temperature control and uniform heat distribution are critical.

Thanks to its semi-automatic operation, the WDS620 strikes a perfect balance between manual control and automation, offering technicians the flexibility to handle delicate components with care while benefiting from consistent heating and precise component placement. This makes it especially suitable for repairing motherboards, CPUs, graphics cards, and other electronic assemblies that require meticulous handling and exact thermal profiles.

Designed for professional repair shops and manufacturing after-service centers, this BGA rework station supports a minimum order quantity of just one unit, making it accessible for both small and large-scale operations. It is supplied in a sturdy wooden case to ensure safe delivery within 3-5 days after payment via TT, with a supply ability of 200 units, demonstrating WDS’s commitment to reliability and customer satisfaction.

In summary, the WDS620 Semi Automatic BGA Rework Station is an essential tool for anyone involved in motherboard repair, CPU repair, and other precision electronic rework tasks. Its combination of an optical alignment system, dual 1200W hot air heaters, and CE certification makes it a top choice for quality, efficiency, and safety in electronic component rework.

 

Customization:

Introducing the WDS Semi Automatic BGA Rework Station, model number WDS620, designed and manufactured in CHINA. This advanced BGA rework station is ideal for precise motherboard repair, featuring a high-accuracy optical alignment system that ensures placement accuracy of ±0.01mm.

Certified with CE, the WDS620 guarantees quality and reliability. It supports a power supply of 220V/110V and can handle a maximum mounting load of 300g, making it suitable for a wide range of repair tasks. The unit weighs 55kg and measures L800 x W780 x H810mm, providing a stable and robust platform for your rework needs.

Each unit is carefully packaged in a sturdy wooden case to ensure safe delivery. With a minimum order quantity of 1 and a supply ability of 200 units, we offer flexible purchasing options. Delivery time is fast, typically within 3-5 days, and payment terms are convenient with TT.

Choose the WDS620 Semi Automatic BGA Rework Station for efficient and accurate motherboard repair, enhanced by its superior optical alignment system and reliable performance.

 

Support and Services:

The Semi Automatic BGA Rework Station is designed to provide precise and efficient soldering and desoldering for Ball Grid Array (BGA) components. It features advanced temperature control and an easy-to-use interface, ensuring high reliability and repeatability in rework processes.

Our technical support team offers comprehensive assistance to help you get the most out of your BGA Rework Station. This includes guidance on setup, operation, and maintenance to optimize performance and extend the lifespan of your equipment.

We provide detailed user manuals and troubleshooting guides to address common issues and questions. Additionally, software updates and calibration services are available to keep your station operating at peak efficiency.

For service and repair, we recommend regular maintenance checks and timely replacement of consumable parts to avoid unexpected downtime. Our support team is ready to assist with diagnostics and repair procedures to minimize disruption.

Whether you are a beginner or an experienced technician, our resources and expert support ensure that your Semi Automatic BGA Rework Station delivers consistent and high-quality results in your rework applications.

 

Packing and Shipping:

Product Packaging and Shipping for Semi Automatic BGA Rework Station

The Semi Automatic BGA Rework Station is carefully packaged to ensure it reaches you in perfect condition. Each unit is securely placed inside a sturdy, custom-designed cardboard box with protective foam inserts to prevent any damage during transit. All accessories, including the power cable, soldering tools, and user manual, are neatly packed within the box.

For added safety, the packaging is sealed with tamper-evident tape and clearly labeled with handling instructions such as "Fragile" and "Handle with Care."

Shipping is available worldwide with multiple courier options to suit your needs, including express and standard delivery services. Tracking information will be provided once the order is dispatched, allowing you to monitor the shipment until it arrives at your doorstep.

We ensure timely delivery and reliable service to guarantee that your Semi Automatic BGA Rework Station arrives safely and ready for use.

 

FAQ:

Q1: What is the brand and model number of the Semi Automatic BGA Rework Station?

A1: The brand name is WDS, and the model number is WDS620.

Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?

A2: It is manufactured in China.

Q3: Does the WDS620 BGA Rework Station have any certifications?

A3: Yes, the product is CE certified.

Q4: What is the minimum order quantity for the WDS620 Semi Automatic BGA Rework Station?

A4: The minimum order quantity is 1 unit.

Q5: How is the product packaged and what is the delivery time?

A5: The WDS620 is packaged in a wooden case and the delivery time is typically 3-5 days.

Q6: What are the payment terms for purchasing the WDS620 BGA Rework Station?

A6: The payment terms are TT (Telegraphic Transfer).

Q7: What is the supply ability of the WDS620 Semi Automatic BGA Rework Station?

A7: The supply ability is 200 units.