Bga Smd IC Chip Rework Reball Station WDS-620 Repair Mobile laptop Ps4 Machine Tool Semi Automatic BGA Rework Station Infrared Hot Air Heating Method Designed for Max 80x80mm BGA Size Rework Process

Product Description:

The Semi Automatic BGA Rework Station is an advanced and highly efficient tool designed specifically for professional motherboard repair and other electronic device refurbishment tasks. Combining precision engineering with robust functionality, this rework station is ideal for technicians and engineers who require reliable and accurate performance when handling complex circuit boards. Featuring a unique heating method that integrates both infrared and hot air technologies, the unit ensures uniform and controlled temperature distribution, minimizing the risk of component damage during the rework process.

One of the standout features of this Semi Automatic BGA Rework Station is its innovative three heating zone system. This design allows for precise control over different parts of the motherboard, enabling targeted heating that adapts to various component sizes and types. By dividing the heating process into three distinct zones, the station can efficiently manage temperature gradients, ensuring optimal solder reflow and reducing thermal stress on sensitive components. This makes it an excellent choice for intricate motherboard repair tasks where precision and care are paramount.

Accuracy is critical when working with BGA components, and this rework station excels with its remarkable placement accuracy of ±0.01mm. Such precision ensures that components are positioned perfectly during the reflow process, significantly reducing the chances of misalignment or soldering defects. This level of accuracy is especially important in the repair and replacement of tiny, densely packed chips commonly found on modern motherboards, where even the slightest deviation can lead to functional failures.

The Semi Automatic BGA Rework Station is designed to accommodate a wide range of PCB sizes, with a maximum working area of 470x380mm. This generous capacity allows technicians to work on various motherboard sizes and other electronic assemblies without the need for multiple tools. The spacious working area enhances versatility, enabling the repair of both small-scale and larger, more complex boards with ease.

Despite its powerful performance, this rework station maintains efficient energy consumption, drawing a maximum power of 5200W. This balance of power and efficiency ensures rapid heating and stable temperature maintenance throughout the rework process, minimizing downtime and improving overall productivity. The combination of high power and controlled heating makes it suitable for demanding repair jobs while maintaining energy efficiency.

In terms of physical design, the Semi Automatic BGA Rework Station is built with practicality and ergonomics in mind. Its dimensions—L800 x W780 x H810mm—make it a compact yet substantial addition to any repair workshop. The size is optimized to provide a stable working platform without occupying excessive space, facilitating easy integration into existing workstations. The semi-automatic functionality further enhances usability by automating critical aspects of the rework process while still allowing the technician to maintain control over key parameters, striking the perfect balance between manual precision and automated efficiency.

Overall, this Semi Automatic BGA Rework Station is a powerful, precise, and versatile tool engineered to meet the rigorous demands of motherboard repair and electronic component rework. Its advanced heating method, combined with the innovative three heating zone design, high placement accuracy, and spacious PCB capacity, makes it an indispensable asset for professionals seeking reliable and high-quality repair equipment. Whether you are engaged in routine maintenance, complex motherboard repairs, or advanced electronic refurbishment, this rework station delivers exceptional performance and consistent results every time.

Features:

• Semi automatic operation for efficient motherboard repair
• Supports PCB size up to 470x380mm
• Power supply options: 220V/110V
• Lightweight design with a total weight of 55kg
• Maximum mounting load capacity of 300g
• Down hot air heater with a maximum power of 1200W
• Equipped with an advanced optical alignment system for precise component placement

Technical Parameters:

Applications:

The WDS620 Semi Automatic BGA Rework Station, manufactured by WDS in China, is a highly efficient and precise tool designed for professional electronics repair and manufacturing environments. Certified by CE and boasting a supply ability of 200 units, this rework station is ideal for various application occasions and scenarios where accuracy and reliability are paramount.

This semi automatic rework station features three heating zones, allowing for controlled and uniform heat distribution during the soldering and desoldering processes. The three heating zone design ensures that the components and the PCB are heated evenly, minimizing the risk of thermal damage and improving the quality of rework. The hot air heating system, combined with advanced sensor technology (2PCS sensors), provides precise temperature control, ensuring optimal performance and consistent results.

In electronics manufacturing facilities, the WDS620 is perfect for reworking complex BGA (Ball Grid Array) components during PCB assembly or repair. Its placement accuracy of ±0.01mm ensures that even the smallest and most delicate components are positioned correctly, reducing errors and enhancing production efficiency. The semi automatic operation mode simplifies the rework process, making it accessible to technicians with varying skill levels while maintaining high precision.

Repair shops and service centers benefit greatly from the WDS620’s versatility and reliability. Whether repairing mobile phones, laptops, or other consumer electronics, this machine’s powerful 5200W power consumption supports rapid heating and cooling cycles, speeding up turnaround times. Its compact dimensions (L800xW780xH810mm) and manageable weight of 55kg make it suitable for both stationary workshop setups and mobile service units.

The WDS620 is packaged securely in a wooden case to ensure safe delivery within 3-5 days after order confirmation. With a minimum order quantity of just one unit and payment terms via TT, this product is accessible for small businesses and large-scale manufacturers alike.

Overall, the WDS Semi Automatic BGA Rework Station WDS620 is an indispensable tool in scenarios requiring high precision, efficient heating control, and dependable performance, making it ideal for PCB repair, prototype development, and precision electronics manufacturing.

Customization:

Introducing the WDS Semi Automatic BGA Rework Station, model WDS620, designed for precise motherboard repair and efficient hot air heating. Manufactured in CHINA and certified with CE, this advanced BGA rework station offers reliable performance with a maximum BGA size of 80x80mm and supports PCB thickness ranging from 0.3 to 5mm.

Equipped with a three heating zone system, the WDS620 ensures uniform temperature distribution, minimizing thermal stress and enhancing repair quality. The station accommodates a maximum mounting load of 300g, making it suitable for various rework tasks.

We supply the WDS Semi Automatic BGA Rework Station with a durable wooden case packaging to ensure safe delivery. With a weight of 55kg and a power supply option of 220V/110V, this product is optimized for versatile use in different working environments.

Our supply ability reaches up to 200 units, with a minimum order quantity of 1 unit. Delivery time is fast, typically between 3-5 days, and payment terms are flexible with TT accepted.

Choose the WDS620 for your motherboard repair needs and experience efficient, reliable hot air heating with three heating zones designed to provide optimal rework results.

Support and Services:

The Semi Automatic BGA Rework Station is designed to provide precise and efficient soldering and desoldering of Ball Grid Array (BGA) components. It features advanced temperature control, ensuring consistent heat distribution to prevent damage to sensitive components during the rework process.

This station is equipped with a user-friendly interface, allowing technicians to set and monitor temperature profiles tailored to specific PCB and BGA types. The semi-automatic function streamlines the rework process by automating critical steps such as preheating, solder melting, and cooling, improving accuracy and repeatability.

Durability and reliability are ensured through high-quality components and robust construction, making this rework station suitable for both small-scale repairs and production environments. The system supports a wide range of BGA sizes and types, providing versatility for various electronic repair and manufacturing tasks.

Additionally, the station includes safety features such as overheating protection and automatic shutdown to safeguard both the operator and the equipment. Comprehensive documentation and software updates are provided to enhance user experience and maintain optimal performance.

Overall, the Semi Automatic BGA Rework Station is an essential tool for electronics professionals seeking a balance between manual control and automation in BGA rework applications.

Packing and Shipping:

Product Packaging:

The Semi Automatic BGA Rework Station is carefully packaged to ensure safe delivery and protection during transit. It is securely placed inside a sturdy, custom-designed cardboard box with shock-absorbing foam inserts to prevent any damage. The package includes the main unit, necessary accessories, user manual, and power cables, all neatly organized and securely fastened.

Shipping:

We offer reliable shipping options to deliver the Semi Automatic BGA Rework Station to your location promptly. The product is shipped via reputable courier services with tracking available for your convenience. Shipping times may vary depending on the destination, and customers will be notified with tracking information once the order has been dispatched. International shipping is available with appropriate customs documentation provided.

FAQ:

Q1: What is the brand and model number of this Semi Automatic BGA Rework Station?

A1: The brand is WDS and the model number is WDS620.

Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?

A2: It is made in China.

Q3: Does the WDS620 have any certifications?

A3: Yes, it is CE certified.

Q4: What is the minimum order quantity for the WDS620 BGA Rework Station?

A4: The minimum order quantity is 1 unit.

Q5: How is the WDS620 packaged for delivery and what is the typical delivery time?

A5: The product is packaged in a wooden case and the typical delivery time is 3-5 days.

Q6: What are the payment terms for purchasing the WDS620?

A6: The payment terms are TT (Telegraphic Transfer).

Q7: What is the supply ability of the WDS620 Semi Automatic BGA Rework Station?

A7: The supply ability is 200 units.