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Product Description:

The Semi Automatic BGA Rework Station is a highly advanced and efficient tool designed for precision repair and rework of BGA (Ball Grid Array) components. This state-of-the-art machine integrates cutting-edge technology to ensure reliable and accurate performance, making it an essential piece of equipment for electronics repair professionals, especially those specializing in CPU repair and other delicate semiconductor processes.

One of the standout features of this BGA rework station is its powerful upper hot air heater, which delivers a maximum power output of 1200W. This robust heating capability ensures rapid and uniform hot air heating, crucial for evenly melting solder balls and preventing damage to sensitive components. The combination of infrared and hot air heating methods enhances the heating efficiency and accuracy, allowing technicians to perform rework tasks with confidence and precision.

With a total power consumption of 5200W, the Semi Automatic BGA Rework Station offers a high-performance solution for demanding repair jobs. Despite its powerful heating elements, the system is engineered to maintain stable temperature control and energy efficiency. This balance between power and precision reduces the risk of thermal damage to PCBs and components, safeguarding the integrity of the repair.

Precision is paramount in BGA rework, and this station excels with an exceptional placement accuracy of ±0.01mm. Such fine accuracy ensures that BGA components are positioned perfectly on the PCB, which is critical for reliable solder joints and long-lasting repairs. The semi-automatic operation streamlines the alignment process, reducing human error and increasing productivity in repair workflows.

The BGA size capability of this station supports components with a maximum size of 80x80mm, accommodating a wide range of BGA chips used in modern electronic devices. Whether you are repairing CPUs, GPUs, or other complex ICs, this rework station provides the versatility needed to handle various component sizes and types with ease.

Designed with user convenience in mind, the Semi Automatic BGA Rework Station features intuitive controls and an ergonomic layout. The integration of infrared heating with hot air heating ensures rapid heat-up times and precise temperature management, which is essential for delicate CPU repair tasks where overheating can cause irreversible damage. This hybrid heating approach improves thermal distribution and reduces repair cycle times.

In summary, the Semi Automatic BGA Rework Station is a powerful, precise, and reliable tool tailored for professionals involved in hot air heating processes, CPU repair, and comprehensive BGA rework operations. Its combination of a high-power upper hot air heater, advanced heating methods, precise placement accuracy, and support for large BGA sizes makes it an indispensable asset in electronics repair and manufacturing environments. With this station, technicians can achieve high-quality repairs, ensuring the longevity and performance of critical electronic components.

Features:

• Product Name: Semi Automatic BGA Rework Station
• Heating Method: Infrared + Hot Air
• Features three heating zones for precise temperature control
• Includes an Infrared preheating table for uniform heating
• Suitable for BGA sizes up to 80x80mm
• Maximum mounting load: 300g
• Compact dimensions: L800 x W780 x H810mm
• Power Supply: 220V/110V
• Efficient BGA rework station designed for reliable performance

Technical Parameters:

Applications:

The WDS Semi Automatic BGA Rework Station, model number WDS620, is a highly efficient and reliable tool designed specifically for precision tasks such as motherboard repair and CPU repair. Manufactured in China and certified with CE, this rework station meets high standards of quality and safety, making it an ideal choice for electronics repair professionals and technicians. Its semi-automatic functionality combined with dual sensors ensures precise control of the hot air heating process, which is crucial for delicate BGA component rework.

With a maximum BGA size of 80x80mm and the ability to handle PCB thicknesses ranging from 0.3mm to 5mm, the WDS620 is versatile enough to accommodate various types of circuit boards and chipsets. This makes it particularly suitable for repairing motherboards in laptops, desktops, and other electronic devices where BGA reballing, soldering, or replacement is required. The hot air heating system provides uniform temperature distribution, reducing the risk of thermal damage to sensitive components during the repair process.

Thanks to its compact dimensions (L800xW780xH810mm) and manageable weight of 55kg, the WDS620 is portable enough for use in repair workshops and service centers without occupying excessive space. The wooden case packaging ensures safe and secure transportation, and with a supply ability of 200 units and a delivery time of just 3-5 days, it is readily available to meet urgent demands. Payment terms are convenient with TT accepted, and the minimum order quantity is just one unit, making it accessible for both small businesses and larger repair facilities.

This semi-automatic rework station is an indispensable tool during motherboard repair and CPU repair tasks, providing technicians with precise control over the soldering and desoldering processes. The combination of its advanced hot air heating system and dual sensors allows for efficient temperature monitoring and adjustment, increasing repair success rates and reducing turnaround times. Whether you are upgrading, refurbishing, or fixing high-value electronics, the WDS620 from WDS offers a professional solution to meet your rework needs.

Customization:

Introducing the WDS WDS620 Semi Automatic BGA Rework Station, a premium product originating from CHINA and certified with CE standards. Designed with a three heating zone system, this station ensures precise and efficient CPU repair, making it an essential tool for electronics professionals.

The WDS620 supports a maximum PCB size of 470x380mm, providing ample space for various repair tasks. Its semi automatic placement mode combines ease of use with high accuracy, enhancing productivity in your repair operations.

With a power consumption of 5200W and a flexible power supply option of 220V/110V, this rework station is both powerful and adaptable to different working environments. The compact dimensions of L800xW780xH810mm make it suitable for any workspace without compromising performance.

Each unit is carefully packaged in a sturdy wooden case to ensure safe delivery. We offer a minimum order quantity of 1, with a supply ability of 200 units and a prompt delivery time of 3-5 days. Payment terms are TT for your convenience.

Choose the WDS620 for reliable, semi automatic BGA rework solutions that meet the highest standards of quality and efficiency.

Support and Services:

The Semi Automatic BGA Rework Station is designed for precise and efficient repair of Ball Grid Array (BGA) components on printed circuit boards (PCBs). It features advanced temperature control, accurate positioning, and user-friendly operation to ensure high-quality rework results.

Our technical support team provides comprehensive assistance including setup guidance, troubleshooting, and maintenance tips to maximize the performance and lifespan of your BGA rework station.

Services include software updates, calibration, and repair services carried out by certified technicians to maintain optimal functionality and safety standards.

We also offer training sessions and detailed user manuals to help operators understand the full capabilities of the system and perform rework tasks effectively.

For any technical inquiries or service requests, please refer to the support section on our website or consult the product documentation provided with your purchase.

Packing and Shipping:

Product Packaging:

The Semi Automatic BGA Rework Station is carefully packaged to ensure safe delivery and protection against damage during transit. The product is securely placed in a custom-fitted foam insert within a sturdy, high-quality cardboard box. All accessories, including the power cable, soldering tools, and user manual, are neatly organized and packed alongside the main unit. The packaging is designed to be compact yet robust, minimizing movement inside the box while providing ample cushioning.

Shipping:

We offer reliable shipping options to ensure your Semi Automatic BGA Rework Station arrives promptly and in perfect condition. The product is shipped via trusted courier services with tracking available for all orders. Shipping times vary depending on the destination but typically range from 3 to 7 business days for domestic deliveries. International shipping options are also available, with delivery times dependent on customs processing and location. Each shipment includes insurance coverage for added peace of mind.

FAQ:

Q1: What is the brand and model number of the Semi Automatic BGA Rework Station?

A1: The brand is WDS and the model number is WDS620.

Q2: Where is the WDS620 Semi Automatic BGA Rework Station manufactured?

A2: It is manufactured in China.

Q3: Does the WDS620 BGA Rework Station have any certifications?

A3: Yes, it is CE certified.

Q4: What is the minimum order quantity for the WDS620 BGA Rework Station?

A4: The minimum order quantity is 1 unit.

Q5: How is the WDS620 BGA Rework Station packaged for delivery?

A5: It is packaged in a wooden case to ensure safe transportation.

Q6: What is the typical delivery time after placing an order for the WDS620?

A6: The delivery time is typically 3-5 days.

Q7: What payment terms are accepted for purchasing the WDS620 BGA Rework Station?

A7: Payment is accepted via TT (Telegraphic Transfer).

Q8: What is the supply capacity of the WDS620 Semi Automatic BGA Rework Station?

A8: The supply ability is 200 units.