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Home > Products > Semi Automatic BGA Rework Station > WDS-650 BGA Rework Station motherboard repair device featuring touchscreen HMI PLC control designed for and circuit board fault correction

WDS-650 BGA Rework Station motherboard repair device featuring touchscreen HMI PLC control designed for and circuit board fault correction

Product Details

Brand Name: Wisdomshow

Certification: CE

Model Number: WDS-650

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Packaging Details: Wooden Case

Delivery Time: 3-5days

Payment Terms: TT

Supply Ability: 200

Get Best Price
Highlight:
Lcd Monitor:
15" Color LCD Monitor
Type:
Semi Automatic
Voltage:
Single Phase AC 220V ± 10% / 50 Hz
Total Powe:
6800 W
Temp Seasuring Interface:
3pcs
Overall Dimension:
655 × 620 × 590 Mm
Machine Mode:
Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual
Maximum Load:
300g
Lcd Monitor:
15" Color LCD Monitor
Type:
Semi Automatic
Voltage:
Single Phase AC 220V ± 10% / 50 Hz
Total Powe:
6800 W
Temp Seasuring Interface:
3pcs
Overall Dimension:
655 × 620 × 590 Mm
Machine Mode:
Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual
Maximum Load:
300g
WDS-650 BGA Rework Station motherboard repair device featuring touchscreen HMI PLC control designed for and circuit board fault correction

Product Description:

The Semi Automatic BGA Rework Station is a highly advanced and reliable solution designed for precision soldering and rework of Ball Grid Array (BGA) components. Engineered to meet the demands of modern electronics manufacturing and repair, this rework station combines cutting-edge technology with user-friendly features to ensure exceptional performance and accuracy.

This BGA rework station features a robust semi-automatic operation mode, allowing technicians to achieve consistent and high-quality results with minimal manual intervention. One of the standout attributes of this system is its incorporation of a three heating zone design. These three distinct heating zones enable precise control of temperature across different areas of the PCB and the BGA component, ensuring uniform heat distribution and reducing the risk of thermal damage. This feature is particularly advantageous for handling sensitive and complex components, as it helps maintain the integrity of surrounding circuits during the rework process.

In terms of dimensions, the unit offers a compact yet substantial build, measuring 82*72*89 cm and weighing approximately 90 kg. Its overall dimension stands at 655 * 620 * 590 mm, providing a stable and ergonomic workspace without occupying excessive bench space. Despite its solid construction, the station is designed with user convenience in mind, allowing easy integration into various production and repair environments.

Temperature management is at the core of the station’s functionality. Equipped with three temperature measuring interfaces, this system monitors heat levels with exceptional precision, enabling operators to maintain optimal thermal conditions throughout the rework process. The temperature precision is maintained within ±1℃, which is critical for preventing overheating or insufficient heating that could compromise the quality of solder joints or damage the components.

Another key feature of this BGA rework station is its advanced optical alignment system. This system provides high-accuracy visual guidance to position BGA components precisely on PCBs before the reflow process begins. The optical alignment system significantly reduces human error, improves alignment efficiency, and enhances the overall success rate of each rework operation. With the aid of this system, technicians can easily align components with fine pitch patterns, making it suitable for working with the latest generation of microelectronics.

The semi-automatic operation combined with the three heating zones and the optical alignment system makes this BGA rework station an indispensable tool for electronics manufacturers, repair centers, and research laboratories. It supports a wide range of applications, including component replacement, PCB repair, and prototype development, offering flexibility and reliability in every task.

In conclusion, the Semi Automatic BGA Rework Station is a comprehensive solution that balances high precision, advanced heating technology, and intelligent alignment capabilities. Its well-thought-out dimensions, weight, and temperature control features make it a powerful yet accessible tool for professionals seeking to enhance their BGA rework processes. Whether for small-scale repairs or larger production runs, this rework station delivers consistent performance, helping users achieve excellent soldering quality with improved efficiency and reduced risk of component damage.


Features:

  • Product Name: Semi Automatic BGA Rework Station
  • Applicable PCB Size: Up to 470 * 380 mm
  • Minimum Order Quantity: 1 Piece
  • LCD Monitor: 15" Color LCD Monitor for clear display
  • Overall Dimension: 655 * 620 * 590 mm
  • Machine Modes: Five Modes including Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, and Manual
  • Features semi automatic operation for efficient motherboard repair
  • Equipped with hot air heating technology to ensure precise and uniform component reflow
  • Ideal for professional motherboard repair and BGA component rework

Technical Parameters:

Voltage Single Phase AC 220V ± 10% / 50 Hz
Dimensions 82*72*89cm, 90kg
Temp Measuring Interface 3pcs
Type Semi Automatic
LCD Monitor 15" Color LCD Monitor
Control System Touchscreen HMI + PLC Control
Down Heater Power 4000 W (2000 W Controlled)
Applicable PCB 470 * 380 mm (max)
Maximum Load 300g
Machine Mode Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual

Applications:

The Wisdomshow WDS-650 Semi Automatic BGA Rework Station is an essential tool designed for precise and efficient repair and rework of Ball Grid Array (BGA) components. This advanced rework station, manufactured in China and CE certified, is perfect for electronics repair shops, manufacturing lines, research and development labs, and educational institutions where high accuracy and reliability are paramount.

The WDS-650 model features a semi automatic operation mode that significantly enhances user control while maintaining ease of use. Its integrated optical alignment system ensures exact positioning of BGA components, which is critical for minimizing errors during the rework process. This system allows technicians to align chips with pinpoint accuracy, reducing the risk of damage to delicate circuit boards and components.

Hot air heating technology is at the core of the WDS-650, providing uniform and controlled heat distribution. With temperature precision of ±1℃, the station can safely and effectively reflow solder on PCBs, ensuring strong and reliable connections. The capability to handle a minimum PCB size of 10*10MM makes it versatile for a wide range of electronic devices, from small gadgets to larger circuit boards.

The rework station’s overall compact dimensions (655 * 620 * 590 mm) make it suitable for benchtop use without occupying excessive space. It operates on a single phase AC 220V ± 10% / 50 Hz power supply, which is standard in many regions, ensuring compatibility and ease of installation. The product is packaged securely in a wooden case to prevent damage during shipping, and with a delivery time of just 3-5 days and a supply ability of 200 units, it meets the demands of businesses requiring quick turnaround.

Ideal for occasions such as electronic device refurbishment, prototype development, quality control testing, and delicate component replacement, the Wisdomshow WDS-650 supports technicians by providing semi automatic functionality combined with advanced optical alignment and precise hot air heating. Payment terms via TT make procurement straightforward, with a minimum order quantity of just one unit, making it accessible for small-scale operations and larger enterprises alike.