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Home > Products > Semi Automatic BGA Rework Station > WDS-650 Semi Automatic BGA Rework Station Handling PCB 470 × 380 Mm Maximum Load 300g Soldering Solution

WDS-650 Semi Automatic BGA Rework Station Handling PCB 470 × 380 Mm Maximum Load 300g Soldering Solution

Product Details

Brand Name: Wisdomshow

Certification: CE

Model Number: WDS-650

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Packaging Details: Wooden Case

Delivery Time: 3-5days

Payment Terms: TT

Supply Ability: 200

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Highlight:
Temperature Precision:
± 1℃
Type:
Semi Automatic
Applicable Pcb:
470 × 380 Mm(max)
Dimensions:
82*72*89cm 90kg
Temp Seasuring Interface:
3pcs
Total Powe:
6800 W
Overall Dimension:
655 × 620 × 590 Mm
Machine Mode:
Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual
Temperature Precision:
± 1℃
Type:
Semi Automatic
Applicable Pcb:
470 × 380 Mm(max)
Dimensions:
82*72*89cm 90kg
Temp Seasuring Interface:
3pcs
Total Powe:
6800 W
Overall Dimension:
655 × 620 × 590 Mm
Machine Mode:
Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual
WDS-650 Semi Automatic BGA Rework Station Handling PCB 470 × 380 Mm Maximum Load 300g Soldering Solution

Product Description:

The Semi Automatic BGA Rework Station is a highly advanced and efficient tool designed specifically for repairing and refurbishing motherboards and other electronic components that require precision and reliability. Equipped with a state-of-the-art Touchscreen HMI combined with PLC control, this BGA rework station offers intuitive operation and precise control over every aspect of the rework process, making it an indispensable device for professionals in electronics repair and manufacturing.

One of the standout features of this semi automatic BGA rework station is its robust hot air heating system. The down heater boasts a powerful 4000 W capacity, with 2000 W of that power being carefully controlled to ensure even and consistent heating. This precise temperature regulation is crucial for preventing damage to sensitive components on the motherboard during repair. By utilizing hot air heating technology, the station ensures uniform heat distribution, which is essential for safely removing and reattaching Ball Grid Array (BGA) components without compromising the integrity of the PCB or the solder joints.

Operating on a single-phase AC 220V ± 10% at 50 Hz voltage supply, the unit is suitable for a variety of work environments and offers reliable performance without the need for specialized electrical setups. Its minimum PCB size capability of 10*10 mm allows technicians to work on a wide range of board sizes, from small-scale repairs on compact devices to more extensive motherboard refurbishments. This flexibility makes the BGA rework station a versatile solution in any electronics repair workshop.

The combination of a touchscreen HMI and PLC control system enhances user experience by providing a clear and responsive interface for setting and monitoring temperature, airflow, and timing parameters. This minimizes human error and optimizes the rework process, ensuring high-quality results every time. The touchscreen interface allows operators to quickly adjust settings and access various operational modes, streamlining the workflow and reducing downtime.

Designed for both efficiency and precision, the semi automatic BGA rework station is ideal for motherboard repair tasks that demand careful handling and meticulous attention to detail. Whether dealing with delicate BGA chips or other surface-mounted components, this device provides the necessary control and heating capabilities to perform repairs with confidence. Its semi automatic nature strikes a balance between manual control and automation, giving skilled technicians the flexibility to customize the rework process while benefiting from automated features that enhance consistency.

Additionally, the station is built for durability and reliability, making it a long-term investment for repair shops and manufacturing facilities. The minimum order quantity of just one piece allows businesses of all sizes to acquire this advanced equipment without the need for bulk purchasing, facilitating easy integration into existing repair workflows.

In summary, the Semi Automatic BGA Rework Station is a cutting-edge tool that combines powerful hot air heating technology with an advanced control system to deliver precise, reliable, and efficient motherboard repair solutions. Its robust heating power, user-friendly touchscreen interface, and flexible PCB size compatibility make it an essential piece of equipment for professionals aiming to achieve high-quality results in BGA rework and electronic component refurbishment.


Features:

  • Product Name: Semi Automatic BGA Rework Station
  • Maximum Load Capacity: 300g
  • Voltage: Single Phase AC 220V ± 10% / 50 Hz
  • Dimensions: 82 x 72 x 89 cm
  • Weight: 90 kg
  • Minimum PCB Size: 10 x 10 mm
  • Total Power Consumption: 6800 W
  • Equipped with an advanced optical alignment system for precise component placement
  • Utilizes efficient hot air heating technology for effective BGA rework
  • Designed specifically as a reliable BGA rework station for repairing and replacing ball grid arrays

Technical Parameters:

Minimum Order 1 Piece
Type Semi Automatic
Control System Touchscreen HMI + PLC Control
Temperature Measuring Interface 3 pcs
Dimensions 82 * 72 * 89 cm, 90 kg
Temperature Precision ± 1℃
LCD Monitor 15" Color LCD Monitor
Overall Dimension 655 * 620 * 590 mm
Maximum Load 300 g
Total Power 6800 W

Applications:

The Wisdomshow WDS-650 Semi Automatic BGA Rework Station is an advanced solution designed for precision electronic repair and manufacturing applications. With its sophisticated five-mode operation—Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, and Manual—the WDS-650 offers unparalleled flexibility to accommodate a wide range of rework scenarios, making it ideal for both small-scale repair shops and large-scale production lines.

This rework station is particularly suited for occasions where high accuracy and reliability are paramount. Featuring a cutting-edge optical alignment system, the WDS-650 ensures precise positioning of BGA components, minimizing errors and enhancing the quality of solder joints. This makes it an excellent choice for repairing or assembling high-density printed circuit boards (PCBs) with minimum PCB sizes as small as 10*10MM.

The inclusion of an Infrared preheating table significantly improves thermal management during the rework process. By uniformly preheating the PCB before soldering or removal, it reduces thermal stress and prevents damage to sensitive components. Coupled with the hot air heating system, which offers precise temperature control with an accuracy of ± 1℃, the station guarantees optimal soldering conditions, enhancing the reliability of the repair or assembly.

Thanks to its robust control system combining a touchscreen HMI and PLC control, users can easily switch between modes and adjust parameters with intuitive interfaces. This makes the WDS-650 suitable for diverse scenarios such as prototype development, small batch production, field repairs, and educational training where both semi-automatic and manual operations are required.

Manufactured in China and certified with CE standards, the Wisdomshow WDS-650 ensures compliance with international safety and quality regulations. With a total power rating of 6800 W, it delivers consistent performance, while its packaging in sturdy wooden cases guarantees safe delivery within 3-5 days. The minimum order quantity is only 1 unit, making it accessible for individual technicians and companies alike, supported by a supply ability of 200 units and flexible payment terms via TT.

In summary, the Wisdomshow WDS-650 Semi Automatic BGA Rework Station is ideal for electronic manufacturing and repair environments demanding high precision, advanced thermal control, and versatile operation modes. Its integration of hot air heating, optical alignment system, and Infrared preheating table makes it an indispensable tool for reworking BGA components with efficiency and accuracy.