Product Details
Brand Name: Wisdomshow
Certification: CE
Model Number: WDS-650
Document: Product Brochure PDF
Payment & Shipping Terms
Minimum Order Quantity: 1
Packaging Details: Wooden Case
Delivery Time: 3-5days
Payment Terms: TT
Supply Ability: 200
Type: |
Semi Automatic |
Machine Mode: |
Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual |
Maximum Load: |
300g |
Lcd Monitor: |
15" Color LCD Monitor |
Total Powe: |
6800 W |
Down Heater Power: |
4000 W (2000 W Controlled) |
Applicable Pcb: |
470 × 380 Mm(max) |
Control System: |
Touchscreen HMI + PLC Control |
Type: |
Semi Automatic |
Machine Mode: |
Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual |
Maximum Load: |
300g |
Lcd Monitor: |
15" Color LCD Monitor |
Total Powe: |
6800 W |
Down Heater Power: |
4000 W (2000 W Controlled) |
Applicable Pcb: |
470 × 380 Mm(max) |
Control System: |
Touchscreen HMI + PLC Control |
The Semi Automatic BGA Rework Station is a highly efficient and reliable tool designed for professionals and technicians working in the field of electronics repair and manufacturing. Combining precision engineering with user-friendly features, this semi automatic device offers exceptional performance in reballing, repairing, and replacing Ball Grid Array (BGA) components on printed circuit boards (PCBs). With dimensions of 82*72*89 cm and weighing 90 kg, this robust machine is engineered to deliver consistent results while maintaining a compact footprint suitable for various workspace settings.
One of the standout features of this Semi Automatic BGA Rework Station is its advanced hot air heating system. The hot air heating technology ensures uniform temperature distribution across the BGA components, significantly reducing the risk of thermal damage to sensitive electronic parts. This precise control of heat application is essential for achieving high-quality solder joints and minimizing rework failures. The hot air heating capability not only enhances the efficiency of the rework process but also improves the overall reliability of the repair outcomes.
Measuring an overall dimension of 655 * 620 * 590 mm, the station is designed to fit comfortably into various production lines or repair benches without occupying excessive space. Despite its compact size, the machine supports a maximum load capacity of up to 300 grams, allowing it to handle a wide range of BGA packages with ease. This capacity makes the station versatile enough to accommodate different component sizes and types, catering to diverse repair and assembly applications.
The semi automatic nature of this BGA Rework Station provides an excellent balance between manual control and automation. Operators benefit from the precision and consistency of automated processes while retaining the flexibility to make adjustments as needed. This blend of features helps reduce operator fatigue and increases throughput without compromising the quality of the rework. The semi automatic system streamlines workflow, making it suitable for both small-scale repair shops and larger manufacturing environments.
In addition to its technical capabilities, the Semi Automatic BGA Rework Station is designed with ease of use in mind. Intuitive controls and clear displays allow operators to set parameters quickly and monitor the heating process in real-time. The hot air heating system can be adjusted to various temperatures and airflow settings, providing the versatility required for different types of BGA components and soldering profiles. This adaptability ensures that users can achieve optimal rework conditions tailored to specific project requirements.
For businesses looking to enhance their electronics repair capabilities, the minimum order quantity of just one piece offers flexibility and accessibility. Whether equipping a single workstation or expanding a production line, this semi automatic BGA rework station represents a valuable investment. Its durable construction and dependable performance translate to long-term cost savings by reducing repair times and improving first-pass yield rates.
Overall, the Semi Automatic BGA Rework Station is an indispensable tool for anyone involved in PCB assembly and repair. Its combination of compact dimensions, robust load capacity, and cutting-edge hot air heating technology ensures superior rework quality and operational efficiency. Designed to meet the demands of modern electronics repair, this semi automatic device delivers precision, reliability, and ease of use in one comprehensive package.
With its focus on hot air heating and semi automatic operation, this BGA rework station stands out as a top choice for professionals seeking to optimize their repair processes. Whether dealing with complex BGA components or routine reballing tasks, the station’s advanced features and solid build quality make it a trusted companion in the electronics industry. Investing in this tool means empowering your workshop with the technology needed to achieve outstanding results every time.
| Control System | Touchscreen HMI + PLC Control |
| Dimensions | 82 * 72 * 89 cm, 90 kg |
| Machine Mode | Five Modes: Automatic Soldering, Automatic Removal, Automatic Placement, Semi-automatic, Manual |
| Applicable PCB | 470 * 380 mm (max) |
| Down Heater Power | 4000 W (2000 W Controlled) |
| Minimum Order | 1 Piece |
| Overall Dimension | 655 * 620 * 590 mm |
| Min PCB Size | 10 * 10 mm |
| Voltage | Single Phase AC 220V ± 10% / 50 Hz |
| LCD Monitor | 15" Color LCD Monitor |
The Wisdomshow WDS-650 Semi Automatic BGA Rework Station is an advanced and reliable solution designed for precise and efficient electronic repairs. Originating from China and certified with CE, this rework station is ideal for various product application occasions and scenarios where high accuracy and versatility are required. With a maximum load capacity of 300g and a temperature precision of ±1℃, it ensures optimal performance in delicate operations such as CPU repair and motherboard repair.
This rework station is widely used in electronic manufacturing and repair workshops, especially for tasks involving surface mount devices (SMDs). Its optical alignment system allows technicians to achieve perfect alignment of BGA chips, significantly reducing the risk of misplacement and damage during soldering or removal processes. This feature makes it invaluable in scenarios where precision is crucial, such as repairing high-density circuit boards on CPUs and motherboards.
The WDS-650 supports five machine modes: automatic soldering, automatic removal, automatic placement, semi-automatic, and manual operation. This flexibility enables users to tailor the rework process according to the complexity of the repair task. For instance, automatic soldering and removal modes are perfect for mass production environments requiring consistent quality, while the semi-automatic and manual modes provide greater control for delicate CPU repair or motherboard repair tasks.
Equipped with a touchscreen HMI and PLC control system, the Wisdomshow WDS-650 offers an intuitive user interface for easy operation and precise adjustments. This control system enhances operator efficiency and reduces the learning curve, making it suitable for both experienced technicians and beginners in electronic repair. Additionally, the wooden case packaging ensures safe delivery, with a prompt delivery time of 3-5 days and a supply ability of 200 units, supporting both small and large-scale orders.
Whether in repair centers, research laboratories, or manufacturing lines, the Wisdomshow WDS-650 Semi Automatic BGA Rework Station is an essential tool for enhancing productivity and repair quality. Its combination of advanced features, compact design, and user-friendly control system make it an excellent choice for professionals engaged in CPU repair, motherboard repair, and other high-precision electronic maintenance tasks.