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Home > Products > Semi Automatic BGA Rework Station > Semi Automatic BGA Rework Station with ±0.01mm Mounting Accuracy Independent Three-zone Control and Upper Lower Hot Air Heating

Semi Automatic BGA Rework Station with ±0.01mm Mounting Accuracy Independent Three-zone Control and Upper Lower Hot Air Heating

Product Details

Brand Name: Wisdomshow

Certification: CE

Model Number: WDS-620

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Packaging Details: Wooden Case

Delivery Time: 3-5days

Payment Terms: TT

Supply Ability: 200

Get Best Price
Highlight:

Semi Automatic BGA Rework Station with Three Zone Control

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BGA Rework Station with IR Preheating

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Semi Automatic BGA Station with Hot Air Heating

Power Supply Ac:
Ac 220v ± 10%, 50/60hz
Mounting Accuracy:
±0.01mm
Characteristic:
Independent Three-zone Control, Displays 4 Temperature Curves Simultaneously, Stores Multiple User Data Sets, Real-time Curve Analysis; Fan Speed Saved With Temperature Curve; Gear Rack Drives Upper Heating Head For Durability
Type:
BGA Rework Station
Temp Seasuring Interface:
1 Pc
Heating Zones:
Three Independent Heating Zones
Working Modes:
5 Modes: Disassembly, Soldering, Placement, Semi-automatic, Manual
Dimensions:
L605 × W655 × H710 Mm
Power Supply Ac:
Ac 220v ± 10%, 50/60hz
Mounting Accuracy:
±0.01mm
Characteristic:
Independent Three-zone Control, Displays 4 Temperature Curves Simultaneously, Stores Multiple User Data Sets, Real-time Curve Analysis; Fan Speed Saved With Temperature Curve; Gear Rack Drives Upper Heating Head For Durability
Type:
BGA Rework Station
Temp Seasuring Interface:
1 Pc
Heating Zones:
Three Independent Heating Zones
Working Modes:
5 Modes: Disassembly, Soldering, Placement, Semi-automatic, Manual
Dimensions:
L605 × W655 × H710 Mm
Semi Automatic BGA Rework Station with ±0.01mm Mounting Accuracy Independent Three-zone Control and Upper Lower Hot Air Heating

Product Description:

The Semi Automatic BGA Rework Station is a highly efficient and reliable solution designed for precision cpu repair and electronic component rework. Engineered to meet the demands of modern electronics servicing, this advanced machine combines state-of-the-art technology with user-friendly features, making it an indispensable tool for technicians and engineers working on complex circuit boards.

One of the standout features of this BGA Rework Station is its high-definition touchscreen HMI (Human-Machine Interface). The touchscreen provides an intuitive and smooth user experience, allowing operators to easily navigate through various settings and control parameters. This enhances the accuracy and efficiency of the rework process, ensuring that every task is executed with precision.

Designed as a Semi automatic system, the BGA Rework Station offers the perfect balance between manual control and automated functionality. This semi automatic operation allows technicians to maintain a high level of control over the rework process while benefiting from automation that improves consistency and reduces human error. As a result, this machine is ideal for cpu repair applications where meticulous handling and precise temperature control are critical.

The heating system of this BGA Rework Station is particularly noteworthy. It features an advanced combination of upper and lower hot air heating along with bottom infrared (IR) preheating. The upper and lower hot air heating ensures uniform temperature distribution across the component and the surrounding PCB, preventing thermal damage and improving solder joint quality. Meanwhile, the bottom IR preheating gently warms the entire board from underneath, reducing thermal stress and minimizing warping risks during the reflow process. This tri-zone heating approach is crucial when working with delicate components and densely packed circuit boards.

Another important specification of this rework station is its minimum chip space capability of 0.15mm. This fine resolution allows technicians to work with extremely small components, which are common in modern electronic devices. Whether you are repairing CPUs, GPUs, or other BGA packages, the ability to accurately handle chips with such tight spacing greatly increases the range of applications for this machine.

Despite its powerful capabilities, the machine is designed with practicality in mind. Weighing a net 55 kilograms, it strikes a balance between portability and stability. The weight ensures that the unit remains steady during operation, preventing vibrations that could affect the precision of the rework process, while still being manageable enough for use in various workshop environments.

Overall, the Semi Automatic BGA Rework Station is an essential tool for any electronics repair professional focused on cpu repair and other BGA component servicing. Its combination of hot air heating and IR preheating, together with a high-definition touchscreen interface and semi automatic operation, offers unparalleled control and reliability. Whether you are involved in prototyping, batch repairing, or detailed rework tasks, this machine delivers consistent results with minimal risk of damage to sensitive electronic parts.

Investing in this advanced BGA Rework Station means enhancing your repair capabilities, reducing turnaround times, and improving the quality of your work. The precision and versatility offered by the minimum chip space of 0.15mm empower technicians to handle even the most challenging repair jobs. In conclusion, this Semi automatic BGA Rework Station is a smart, efficient, and dependable choice for anyone seeking a high-performance solution for cpu repair and related electronic rework needs.


Features:

  • Product Name: Semi Automatic BGA Rework Station
  • High-definition Touchscreen HMI for easy operation
  • Power Supply: AC 220V ± 10%, 50/60Hz
  • Independent three-zone temperature control for precise heating
  • Displays 4 temperature curves simultaneously for comprehensive monitoring
  • Stores multiple user data sets for customized repair processes
  • Real-time curve analysis to ensure optimal rework results
  • Fan speed saved with temperature curve for consistent airflow management
  • Gear rack drives upper heating head, enhancing durability and stability
  • Heating Body: Upper/lower hot air heating combined with bottom IR preheating
  • Equipped with a semi automatic optical alignment system for accurate positioning
  • Ideal for motherboard repair with high precision and efficiency
  • Packaging Type: Wooden box for secure and safe transportation

Technical Parameters:

Power Supply AC AC 220v ± 10%, 50/60Hz
Min Chip Space 0.15mm
Working Modes 5 Modes: Disassembly, Soldering, Placement, Semi-automatic, Manual
Heating Zones Three Independent Heating Zones
Mounting Accuracy ±0.01mm
Touch Screen High-definition Touchscreen HMI
Characteristic Independent Three-zone Control, Displays 4 Temperature Curves Simultaneously, Stores Multiple User Data Sets, Real-time Curve Analysis; Fan Speed Saved With Temperature Curve; Gear Rack Drives Upper Heating Head For Durability; Semi automatic operation with optical alignment system
Type BGA Rework Station
Packaging Type Wooden Box
Dimensions L605 × W655 × H710 Mm

Applications:

The Wisdomshow WDS-620 Semi Automatic BGA Rework Station is an advanced and reliable solution designed specifically for professional motherboard repair and electronic component rework. This high-precision BGA rework station, certified with CE standards and manufactured in China, combines cutting-edge technology with user-friendly features to ensure efficient and accurate soldering and desoldering of BGA chips and other surface-mounted devices.

One of the standout features of the WDS-620 model is its innovative heating system, which includes an upper and lower hot air heating mechanism coupled with a bottom Infrared preheating table. This combination ensures uniform and controlled heating, minimizing thermal stress on the motherboard and components, thereby significantly reducing the risk of damage during repair. The Infrared preheating table gently warms the PCB from below, while the hot air heating from above precisely targets the BGA components, facilitating smooth removal and reinstallation processes.

The Wisdomshow WDS-620 is ideal for a wide range of application occasions and scenarios. It is extensively used in electronics manufacturing plants, repair shops, and quality control laboratories where motherboard repair is frequently required. Its semi-automatic operation mode allows technicians to achieve high accuracy and repeatability, making it suitable for both small-scale repairs and batch production environments. The high-definition touchscreen HMI provides an intuitive interface, allowing operators to easily set and monitor temperature profiles, airflow rates, and heating durations, enhancing workflow efficiency.

With dimensions of L605 × W655 × H710 mm, this BGA rework station is compact enough to fit into most workbenches yet robust enough to handle complex repair tasks. It is shipped securely in a wooden box for safe transportation, ensuring that the equipment arrives in optimal condition. The supply ability of 200 units and a delivery time of 3-5 days make the WDS-620 a dependable choice for businesses needing prompt and reliable service. Payment terms via TT further facilitate smooth transactions for clients worldwide.

Overall, the Wisdomshow WDS-620 Semi Automatic BGA Rework Station is an indispensable tool for electronic repair professionals. Whether dealing with delicate motherboard repair or intricate component replacement, this BGA rework station’s advanced heating system and user-friendly design provide a perfect balance of precision, safety, and efficiency.