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Home > Products > Manual BGA Rework Station > Factory Directly Supply BGA Rework Station with Touch Panel Interface and Three Temperature Zones for Manual BGA Repair Station

Factory Directly Supply BGA Rework Station with Touch Panel Interface and Three Temperature Zones for Manual BGA Repair Station

Product Details

Place of Origin: China

Brand Name: WDS

Certification: CE

Model Number: WDS-580

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1 UNIT

Packaging Details: Wooden case

Delivery Time: 8-15 working days

Payment Terms: T/T,Western Union,

Supply Ability: 150 UNITS PER MONTH

Get Best Price
Highlight:

Touch Panel Interface BGA Rework Station

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Three Temperature Zones BGA Repair Station

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Factory Directly Supply BGA Workstation

Max PCB Size:
400×370mm
Min PCB Size:
10×10mm
Total Power:
4800W
Temperature Precision:
±3°C
PCB Thickness:
0.3–5mm
Machine Weight:
40kg
Max PCB Size:
400×370mm
Min PCB Size:
10×10mm
Total Power:
4800W
Temperature Precision:
±3°C
PCB Thickness:
0.3–5mm
Machine Weight:
40kg
Factory Directly Supply BGA Rework Station with Touch Panel Interface and Three Temperature Zones for Manual BGA Repair Station
Product Overview

The Wisdomshow WDS580 is a factory-direct BGA rework station engineered for precise, reliable PCB chip rework on telephone and mobile boards. Combining a linear slider system, touch-panel PLC control, and three independent heating zones, it delivers stable, repeatable results for professional repair and production environments.

Key Features
1. Precision Linear Slider

All three axes (X, Y, and Z) support fine tuning and quick orientation, delivering excellent positioning accuracy with fast, maneuverable operation.

2. Touch Panel & PLC Control

A touch-panel interface with PLC control ensures stable, reliable operation. Multiple user temperature profiles can be stored, with password protection and modification functions available at power-on. Temperature profiles are displayed directly on the touch screen.

3. Three Independent Heating Zones

Hot air heats between the upper and lower zones, while IR heat is applied at the bottom, with temperature precision controlled to ±3℃. The upper zone moves freely as needed, and the second zone is adjustable up and down. Top and bottom heaters support simultaneous multi-segment control, and the IR heating zone output power can be adjusted to suit operating requirements.

4. 360° Rotating Nozzle & Uniform IR Heating

The hot air nozzle rotates a full 360 degrees, while the bottom IR heater warms the PCB board evenly.

5. High-Accuracy Closed-Loop Control

A K-type thermocouple closed-loop system enables accurate temperature testing through the external measurement interface. The PCB is positioned by a closed V-shape slot, and flexible universal jigs prevent damage or deformation while accommodating all BGA package sizes.

6. Rapid Cooling & Chip Removal

A large-power fan cools the PCB quickly, and the built-in vacuum pump with external vacuum nozzle makes BGA chip removal easy.

7. Alarm & Early Warning

An alarm prompt signals when welding is complete, with an added early warning function for convenient operation.

8. CE Certified Safety

Equipped with an emergency stop switch and protective equipment that powers off automatically in the event of an abnormal accident. If temperature goes out of control, the circuit cuts power automatically, backed by double over-temperature protection.

Technical Specifications
Total Power 4800W
Upper Heating Power 800W
Lower Heating Power 1200W
Infrared Heating Power 2700W (1200W is controlled)
Power Supply (Single Phase) AC 220V ±10, 50Hz
Location Way V-shape card slot + Universal jigs
Temperature Controlling K-type thermocouple closed-loop control, independent temperature control, precision up to ±3℃
Electrical Material Touch screen + Temperature control module + PLC control
Max PCB Size 400 × 370mm
Min PCB Size 10 × 10mm
Sensor 1 unit
PCB Thickness 0.3–5mm
Suitable Chip Size 1 × 1mm – 60 × 60mm
Machine Size 650 × 590 × 600mm
Weight Net 40kg