Wisdomshow Factory Directly Supply WDS580 Infrared BGA Rework Station BGA Rework Equipment

All three axes (X, Y, and Z) support fine tuning and quick orientation, delivering excellent positioning accuracy with fast, maneuverable operation.

A touch-panel interface with PLC control ensures stable, reliable operation. Multiple user temperature profiles can be stored, with password protection and modification functions available at power-on. Temperature profiles are displayed directly on the touch screen.

Hot air heats between the upper and lower zones, while IR heat is applied at the bottom, with temperature precision controlled to ±3℃. The upper zone moves freely as needed, and the second zone is adjustable up and down. Top and bottom heaters support simultaneous multi-segment control, and the IR heating zone output power can be adjusted to suit operating requirements.

The hot air nozzle rotates a full 360 degrees, while the bottom IR heater warms the PCB board evenly.

A K-type thermocouple closed-loop system enables accurate temperature testing through the external measurement interface. The PCB is positioned by a closed V-shape slot, and flexible universal jigs prevent damage or deformation while accommodating all BGA package sizes.

A large-power fan cools the PCB quickly, and the built-in vacuum pump with external vacuum nozzle makes BGA chip removal easy.

An alarm prompt signals when welding is complete, with an added early warning function for convenient operation.

Equipped with an emergency stop switch and protective equipment that powers off automatically in the event of an abnormal accident. If temperature goes out of control, the circuit cuts power automatically, backed by double over-temperature protection.