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4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 977083CM Specification for Automatic BGA Repair

Product Details

Place of Origin: China

Brand Name: Wisdomshow BGA

Document: Product Brochure PDF

Payment & Shipping Terms

Minimum Order Quantity: 1

Price: 18800

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Product Details

Product Description

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                                                                                                                                                                                                                                                                                                                                                                                                            4200W Rated Capacity BGA Rework Station, 100% Duty Cycle BGA Reballing Machine, 97*70*83CM Specification BGA Repair Machine
                      

Model NO.:	WDS-850	Rated Capacity:	4200W
Rated Duty Cycle:	100%	Machine Type:	BGA Repair Machine
Weight:	210 Kg	Dimensions:	977083CM
Production Capacity:	5000	Up-heater Power:	1200W
Down-heater Power:	1200W	IR Power:	5000W
Max Plate Size:	650*610mm	Preheating Area:	500*420mm
Heat Resistance:	1800 C	Pressure Control:	10 Grams
Temperature Control:	8 Segments

Model NO.:	WDS-850
Rated Capacity:	4200W
Rated Duty Cycle:	100%
Machine Type:	BGA Repair Machine
Weight:	210 Kg
Dimensions:	977083CM
Production Capacity:	5000
Up-heater Power:	1200W
Down-heater Power:	1200W
IR Power:	5000W
Max Plate Size:	650*610mm
Preheating Area:	500*420mm
Heat Resistance:	1800 C
Pressure Control:	10 Grams
Temperature Control:	8 Segments

4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 97*70*83CM Specification for Automatic BGA Repair

BGA Rework Station - Automatic Chip Removal and Mounting Machine

Product Overview

Our BGA Rework Station is designed for professional chip replacement and repair in laptops, mobile phones, gaming consoles (Xbox 360, PS3/PS4), and other electronic devices. Ideal for repair shops and factories providing after-sales service and component rework.

Repair Process

Desoldering: Separate BGA chip from motherboard
Pad cleaning
Reballing or direct BGA chip replacement
Precision alignment (using silk frame or optical camera)
Soldering: Install new BGA chip

Applications

Watch/Mobile/Cell phone repair
Notebook/Laptop/Computer repair
XBOX 360/PS2/PS3/PS4/Wii game console repair
SMD/SMT/IC BGA rework including iCloud removal
BGA VGA, CPU, GPU, ECU and car motherboard soldering/desoldering
BGA chips, QFP QFN chip, PC, PLCC PSP PSY rework

Key Features

Integrated hot air head and mounting head with automatic soldering/desoldering
Independent 3-zone heating system with synchronized upper/lower heater movement
High-precision PCB slider for accurate BGA mounting
German-imported preheating table (500×420mm) with heat-resistant glass (up to 1800°C)
Motor-controlled X/Y axis movement for precise alignment
Maximum PCB size capacity: 650×610mm with no repair dead corners
Built-in vacuum pump with 360° rotation and fine-adjustable suction nozzle
Automatic BGA height detection with pressure control (down to 10g)

Technical Specifications

Heating System	Independent 3-zone temperature control
Upper Heater Power	1200W
Lower Heater Power	1200W
IR Power	5000W

Optical Alignment System

High-definition CCD color optical alignment system with HD LCD monitor

Operation System

HD touch interface with 8-segment temperature control and real-time curve analysis

Safety Features

Password protection against unauthorized modifications
Dual over-temperature protection

Tags:

Semi Automatic BGA Rework Station

Manual BGA Rework Station

Fully Automatic BGA Rework Station

BGA Reballing Machine

Mobile Phone BGA Rework Station

Infrared BGA Rework Station

Offline X-Ray Inspection Machine

Offline X-Ray Counter Machine

Online X-Ray Inspection Machine

Online X-Ray Counter Machine

4200W Rated Capacity BGA Rework Station with 100% Duty Cycle and 977083CM Specification for Automatic BGA Repair