Brief: Watch the demo to catch practical tips and quick performance insights. This video provides a detailed walkthrough of the WDS-700 BGA Reballing Station, showcasing its automatic operation for mobile phone chips. You'll see how the system's five modes—Remove, Mount, Weld, Manual, and Semi-auto—work in practice, along with demonstrations of its precision optical alignment and dual heating zone temperature control.
Related Product Features:
Features five operational modes: Remove, Mount, Weld, Manual, and Semi-auto for flexible chip processing.
Independent dual heating zones with ±1℃ precision and 8-segment temperature control for uniform heating.
High-precision K-type thermocouple closed-loop control with PID self-setting and real-time curve analysis.
HD CCD color optical alignment system with auto focus, aberration resolution, and 15-inch LCD monitor.
HD touch human-machine interface with combined upper heating and mounting head for efficient operation.
360-degree rotatable titanium alloy BGA nozzles with micrometer fine-tuning for ±0.01mm precision.
Automatic alarm and double over-temperature protection with password-secured temperature parameters.
Supports PCB sizes up to 140x160mm and application chips ranging from 1x1mm to 80x80mm.
Faqs:
What are the different operational modes available on the WDS-700 BGA Reballing Station?
The WDS-700 offers five operational modes: Remove, Mount, Weld, Manual, and Semi-auto. These modes can be changed freely, allowing operators to use the station in automatic, semi-automatic, or manual configurations depending on their specific reballing requirements.
How precise is the temperature control system?
The station features an independent dual heating zone temperature control system with precision within ±1℃. It uses high-precision K-type thermocouple closed-loop control with PID parameter self-setting and provides real-time curve analysis through the touch screen interface.
What safety features does the WDS-700 include?
The station includes multiple safety protections: automatic alarm function after BGA welding completes, automatic power-off in case of temperature abuse, double over-temperature protection, and password protection for temperature parameters to prevent unauthorized modifications.
What is the maximum PCB and chip size the machine can handle?
The WDS-700 supports PCB sizes up to 140x160mm (maximum) and down to 5x5mm (minimum). For application chips, it can handle components ranging from 1x1mm to 80x80mm, making it suitable for various mobile phone chip reballing applications.